IP Library Granted Patent US 8,822,881
Granted Patent B2
US 8,822,881 · App. 11/982,258 · Granted Sep 2, 2014

Selective soldering using fiber optic device

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Quick Facts
Patent No.
US 8,822,881
App. No.
11/982,258
Granted
Sep 2, 2014
Kind
B2
Abstract

A fiber optic device for enabling soldering is described. The fiber optic device includes an entry portion comprising an optical fiber bundle for receiving a single light beam wherein the optical fiber bundle splits the light beam into a plurality of separate portions, each of the separate portions for enabling soldering. The fiber optic device further includes an exit portion for emitting each of the plurality of separate portions of the light beam in a pattern to enable soldering at a plurality of locations simultaneously utilizing the single light beam.

Claims (29)

1. A fiber optic device for enabling soldering comprising:

a single entry point for receiving a single optical fiber bundle configured for receiving a single light beam wherein said optical fiber bundle splits said light beam into a plurality of separate portions, each of said separate portions for enabling soldering; and

an exit portion comprising a plurality of apertures, each for positioning a plurality of fibers of said optical fiber bundle and for emitting more than one of said plurality of separate portions of said light beam in a pattern to enable soldering at a plurality of locations simultaneously utilizing said single light beam, wherein a shape of each aperture of said plurality of apertures, a shape of said pattern of said plurality of fibers of said optical fiber bundle, and a shape of a corresponding solder pad match each other.

2. The fiber optic device of claim 1 wherein said pattern substantially matches an array of solder pads associated with a flex cable.

3. The fiber optic device of claim 1 wherein said plurality of apertures is arranged according to a geometry associated with solder locations on a flex cable.

4. The fiber optic device of claim 1 wherein each of said plurality of apertures comprises an equal number of said fibers of said fiber optic bundle.

5. The fiber optic device of claim 1 wherein said pattern enables localized soldering of a plurality of components such that said plurality of separate portions of said light beam is not applied directly to a substrate proximate to said plurality of components.

6. The fiber optic device of claim 1 wherein said exit portion includes an optical lens for focusing each of said plurality of separate portions of said beams at a plurality of flex cable components.

7. A method for soldering comprising:

providing a single entry point for receiving a single fiber optic bundle, said fiber optic bundle configured for receiving a single light beam for enabling soldering, said fiber optic bundle for splitting said single light beam into a plurality of separate beams, each of said separate beams for enabling soldering; and

providing an exit portion comprising a plurality of apertures, each for positioning more than one fiber of said fiber optic bundle, said exit portion for emitting each of said plurality of separate beams in a geometric pattern to enable soldering at a plurality of locations simultaneously with said single light beam, wherein a shape of each aperture of said plurality of apertures, a shape of said pattern of said fibers of said optical fiber bundle, and a shape of a corresponding solder pad match each other.

8. The method of claim 7 further comprising:

determining a geometric layout associated with a plurality of solder pads; and

providing said exit portion such that said pattern is associated with said geometric layout.

9. The method of claim 7 further comprising:

arranging said plurality of apertures according to a geometry associated with solder locations on a flex cable such that said plurality of beams is directed to said solder locations without damaging said flex cable.

10. The method of claim 7 wherein each of said plurality of apertures is associated with an equal portion of said fiber optic bundle.

11. The method of claim 7 further comprising:

focusing each of said plurality of beams with an optical lens at one of said plurality of apertures.

12. A system for soldering comprising:

a light source for generating a single light beam, said light beam for enabling soldering; and

a fiber optic beam shaper for shaping said single beam such that said single beam can be used to enable soldering of a plurality of components simultaneously, said fiber optic beam shaper comprising:

a single entry point for receiving a single optical fiber bundle configured for receiving said single light beam and for splitting said light beam into a plurality of separate portions, each of said portions for enabling soldering; and

an exit portion comprising a plurality of apertures, each for positioning a plurality of fibers of said fiber optic bundle and for emitting more than one of said plurality of separate portions of said single light beam in a shaped pattern to enable soldering said plurality of components simultaneously with said single light beam, wherein a shape of each aperture of said plurality of apertures, a shape of said pattern of said plurality of fibers of said optical fiber bundle, and a shape of a corresponding solder pad match each other.

13. The system of claim 12 wherein said shaped pattern substantially corresponds to a geometric layout of an array of solder pads.

14. The system of claim 12 wherein said plurality of apertures is arranged according to a geometric layout of solder locations on a flex cable.

15. The system of claim 12 wherein said shaped pattern enables localized soldering of said components on a flex cable such that said flex cable is not damaged.

16. The system of claim 12 further comprising:

an optical lens at one of said apertures for focusing each of said plurality of separate portions of said light beam at said plurality of components.

Assignments (7)
PATENT COLLATERAL AGREEMENT - DDTL LOAN AGREEMENT Recorded Aug 21, 2023
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 067045/0156 →
PATENT COLLATERAL AGREEMENT - A&R LOAN AGREEMENT Recorded Aug 21, 2023
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 064715/0001 →
RELEASE OF SECURITY INTEREST AT REEL 052915 FRAME 0566 Recorded Feb 8, 2022
From: JPMORGAN CHASE BANK, N.A.
To: WESTERN DIGITAL TECHNOLOGIES, INC.
Reel/Frame 059127/0001 →
SECURITY INTEREST Recorded Feb 6, 2020
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS AGENT
Reel/Frame 052915/0566 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 6, 2016
From: HGST NETHERLANDS B.V.
To: WESTERN DIGITAL TECHNOLOGIES, INC.
Reel/Frame 040826/0821 →
CHANGE OF NAME Recorded Oct 25, 2012
From: HITACHI GLOBAL STORAGE TECHNOLOGIES NETHERLANDS B.V.
To: HGST NETHERLANDS B.V.
Reel/Frame 029341/0777 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 27, 2007
From: FENG, XIANGYANG
To: HITACHI GLOBAL STORAGE TECHNOLOGIES NETHERLANDS B.V.
Reel/Frame 020167/0551 →