Piezoelectric resonator for oscillator and surface mount type piezoelectric oscillator
View Patent ↗A piezoelectric resonator for an oscillator contained in an upper concave portion of an insulating case that has a metal lid with which the upper concave portion is air-tightly closed comprises a GND electrode being conductively coupled to an earth pattern of the piezoelectric resonator and provided on an outer bottom face of the insulating case, a piezoelectric connecting electrode being conductively coupled to an excite electrode of the piezoelectric resonator and provided on the outer bottom face of the insulating case, and an adjustment electrode being conductively coupled to the metal lid and provided on the outer bottom face of the insulating case in such a way that a regulator circuit in an IC part conductively contacts with the adjustment electrode if the IC part including the oscillation circuit is attached to the outer bottom face of the insulating case, wherein the metal lid serves as an adjustment terminal.
1. A piezoelectric oscillator, comprising:
a piezoelectric resonator having a structure in which a piezoelectric vibrating element is sealed by a first case and a lid; and
an IC part provided with an oscillation circuit;
a second case accommodating the IC part, wherein
the IC part has an input terminal to which a signal for rewriting data in a memory of the IC part is inputted,
the lid has a metal surface,
the first case has, on an outer surface thereof, a first electrode that is in conduction with the metal surface of the lid,
the second case has, on an outer surface thereof, a second electrode that is in conduction with the input terminal, and
the input terminal and the metal surface of the lid are in conduction.
2. The piezoelectric oscillator according to claim 1 , wherein
the first electrode and the second electrode are conductively coupled, and
the second case is mounted to the first case.
3. The piezoelectric oscillator according to claim 1 , wherein the IC part has a structure to provide at least one input terminal.
4. A method for manufacturing a piezoelectric oscillator including:
forming a piezoelectric resonator having a structure in which a piezoelectric vibrating element is sealed by a first case and a lid;
forming an IC part provided with an oscillation circuit; and
forming a second case accommodating the IC part, wherein
the IC part has an input terminal to which a signal for writing data in a memory of the IC part is inputted,
the lid has a metal surface,
the first case has, on an outer surface thereof, a first electrode that is in conduction with the metal surface of the lid,
the second case has, on an outer surface thereof, a second electrode that is in conduction with the input terminal, and
the input terminal and the metal surface of the lid are in conduction; and
inputting the signal to the metal surface of the lid and rewriting data of the memory of the IC part.
5. A piezoelectric oscillator, comprising:
a piezoelectric resonator having a structure in which a piezoelectric vibrating element is sealed by a case and a lid; and
an IC part provided with an oscillation circuit, wherein
the IC part and a metal ball that is in conduction with the IC part are mounted on an outer bottom surface of the case,
the IC part has an input terminal to which a signal for rewriting data in a memory of the IC part is inputted,
the lid has a metal surface, and
the input terminal and the metal surface of the lid are in conduction.
6. The piezoelectric oscillator according to claim 5 , wherein the IC part has a structure to provide at least one terminal.
7. A method for manufacturing a piezoelectric oscillator including:
forming a piezoelectric resonator having a structure in which a piezoelectric vibrating element is sealed by a case and a lid; and
forming an IC part provided with an oscillation circuit, wherein
the IC part and a metal ball that is in conduction with the IC part are mounted on an outer bottom surface of the case,
the IC part has an input terminal to which a signal for rewriting data in a memory of the IC part is inputted,
the lid has a metal surface, and
the input terminal and the metal surface of the lid are in conduction, and:
inputting the signal to the metal surface of the lid and rewriting data of the memory of the IC part.