IP Library Granted Patent US 7,952,410
Granted Patent B2
US 7,952,410 · App. 11/984,638 · Granted May 31, 2011

Semiconductor device and voltage-controlled oscillation circuit

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Quick Facts
Patent No.
US 7,952,410
App. No.
11/984,638
Granted
May 31, 2011
Kind
B2
Abstract

A voltage-controlled oscillation circuit ( 15 ) includes a plurality of independent ring oscillation circuits different in the number of stages; and a selector ( 22 ) selectively outputting as a feedback clock signal (FB) an output of one of the ring oscillation circuits, so that any of the outputs of the independent ring oscillation circuits is always outputted as the feedback clock signal, which makes it possible to output the feedback clock signal keeping a proper duty ratio even when the operating speed is high, allowing arbitrary adjustment of the delay time before an input signal (DLLI) is outputted.

Claims (22)

1. A semiconductor device comprising:

a plurality of cascaded logic gates with inverted outputs; and

a plurality of NAND circuits, one input end of each of the plurality of NAND circuits being coupled to an output end of one of the plurality of cascaded logic gates coupled to a gate of a first transistor, the other input end of the each of the plurality of NAND circuits being coupled to a control signal, and an output of each of the plurality of NAND circuits being open,

wherein load capacitance in the each of the plurality of NAND circuits is oxide film capacitance of the first transistor.

2. The semiconductor device according to claim 1 , wherein the oxide film capacitance is made between a drain of the first transistor and a gate of the first transistor.

3. A semiconductor device comprising:

a plurality of cascaded logic gates with inverted outputs; and

a plurality of NAND circuits, one input end of each of the plurality of NAND circuits being coupled to an output end of one of the plurality of cascaded logic gates via a first transistor and the other input end of the each of the plurality of NAND circuits being coupled to a control signal,

wherein load capacitance in the each of the plurality of NAND circuits is oxide film capacitance of the first transistor,

wherein the plurality of NAND circuits includes a first load capacitance circuit which is connected to output ends of odd-numbered logic gates with inverted outputs and a second load capacitance circuit which is connected to output ends of even-numbered logic gates with inverted outputs, out of the cascaded logic gates with the inverted outputs.

4. A semiconductor device comprising:

a plurality of cascaded logic gates with inverted outputs; and

a plurality of NAND circuits, one input end of each of the plurality of NAND circuits being coupled to an output end of one of the plurality of cascaded logic gates via a first transistor, the other input end of the each of the plurality of NAND circuits being coupled to a control signal, and an output of each of the plurality of NAND circuits being open,

wherein load capacitance in the each of the plurality of NAND circuits is oxide film capacitance of the first transistor,

wherein the control signal is supplied to a gate of a second transistor whose source is coupled to a ground.

5. A semiconductor device comprising:

a plurality of cascaded logic gates with inverted outputs; and

a plurality of NAND circuits, one input end of each of the plurality of NAND circuits being coupled to an output end of one of the plurality of cascaded logic gates via a first transistor, the other input end of the each of the plurality of NAND circuits being coupled to a control signal, and an output of each of the plurality of NAND circuits being open,

wherein load capacitance in the each of the plurality of NAND circuits is oxide film capacitance of the first transistor,

wherein the output end of one of the plurality of cascaded logic gates is coupled to a gate of a third transistor whose source is coupled to a power supply; and

wherein the control signal is supplied to a gate of a fourth transistor whose source is coupled to the power supply.

6. The semiconductor device according to claim 5 , wherein the oxide film capacitance is made between a drain of the third transistor and a gate of the third transistor.

Assignments (4)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 27, 2015
From: FUJITSU SEMICONDUCTOR LIMITED
To: SOCIONEXT INC.
Reel/Frame 035508/0469 →
CHANGE OF NAME Recorded Jul 22, 2010
From: FUJITSU MICROELECTRONICS LIMITED
To: FUJITSU SEMICONDUCTOR LIMITED
Reel/Frame 024748/0328 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 11, 2008
From: FUJITSU LIMITED
To: FUJITSU MICROELECTRONICS LIMITED
Reel/Frame 021977/0219 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 13, 2008
From: YAMANAKA, HIROAKI; KOUSAKA, KUNIMITSU; NISHIWAKI, KIYOSHI
To: FUJITSU LIMITED
Reel/Frame 020942/0305 →