Wireless enabled device
View Patent ↗The invention described herein provides an embedded wireless device such as a RFID tag molded into separate housing formed of any thermoplastic material compatible to that of the plastic material as the device to which the housing is to be attached. Subsequently, the housed tag assembly can be thermally bonded onto the device through many means which are well known and accepted in the industry.
1. A process for attaching a wireless electronic component in a thermoplastic device to a thermoplastic assembly comprising the steps of:
a. forming a thermoplastic device formed of a housing having a first closed substantially planar inner surface and a first outer surface and at least one recess for holding the wireless electronic component;
b. placing the wireless electronic component into the at least one recess;
c. overmolding the at least one recess and wireless electronic component with a thermoplastic to encapsulate the wireless electronic component and form a second outer surface of the housing; wherein either the first outer surface or the second outer surface of the housing has two or more spaced apart protrusions extending away from the outer surface;
d. selecting a thermoplastic assembly; and
e. holding the two or more protrusions of the device against an outer surface of the thermoplastic assembly and at least partially melting the two or more protrusions to form a bond between the outer surface of the thermoplastic assembly and the thermoplastic protrusions of the device.
2. The process of claim 1 wherein the number of protrusions is at least three.
3. The process of claim 1 wherein the number of protrusions is at least three and the protrusions act as centering devices and energy directors for thermally bonding the device to the assembly.
4. The process of claim 1 wherein the assembly is selected from the group consisting of a filter cassette, a filter cartridge, a filter housing, a biobag, a sampling device, a valve, a connector, tubing and combinations thereof.
5. The process of claim 1 wherein the protrusions are bonded to the thermoplastic outer surface of the assembly through the use of heat generated from a method selected from the group consisting of vibration welding, ultrasonic welding and radiant heat.
6. The process of claim 1 wherein the thermoplastic of the device and the thermoplastic of the assembly to which it is attached are compatible.
7. The process of claim 1 wherein the number of protrusions is at least three and at least one of the protrusions is of a different size and dimension from the other protrusions.
8. The process of claim 1 wherein the number of protrusions is at least three and at least one of the protrusions is of a different size and dimension than the other protrusions and wherein the size and dimension is selected from the group consisting of length and height.