Housing for an optoelectronic component emitting electromagnetic radiation, component emitting electromagnetic radiation, and method for the production of a housing or a component

1. A housing for an electromagnetic-radiation-emitting optoelectronic component, comprising:

exterior side faces for the housing; and

a screening layer applied on at least part of the exterior side faces and being suitable for screening an electromagnetic radiation;

wherein the exterior side faces are at least partially inclined with respect to a plane extending perpendicularly to a mounting plane of the housing;

wherein the housing of the electromagnetic-radiation-emitting component comprises a housing body and a leadframe;

wherein the leadframe is encapsulated with the housing body; and

wherein the screening layer extends over portions of the leadframe.

2. The housing according to claim 1 , wherein the screening layer has a black material.

3. The housing according to claim 1 , wherein the screening layer has a lacquer.

4. The housing according to claim 1 , wherein the exterior side faces comprise external faces of a housing body which has ceramic material.

5. The housing according to claim 1 , wherein the exterior side faces comprise external faces of a housing body which has plastic material.

6. The housing according to claim 1 , wherein the exterior side faces are inclined with respect to the plane extending perpendicularly to the mounting plane at least partly between 30° and 60° inclusive.

7. The housing according to claim 1 , wherein at least one exterior side face is essentially completely covered with the screening layer.

8. The housing according to claim 1 , wherein the screening layer comprises plastic.

9. An electromagnetic-radiation-emitting component having at least one luminescence diode, comprising a housing according to claim 1 .

10. A method for producing a housing for an electromagnetic-radiation-emitting optoelectronic component or an electromagnetic-radiation-emitting component, comprising the steps of:

providing a housing or a component having a housing including exterior side faces which are at least partly inclined with respect to a plane extending perpendicularly to a mounting plane of the housing, wherein the housing comprises a housing body and a leadframe encapsulated with the housing body; and

applying a screening layer to at least one portion of exterior side faces of the housing and to the leadframe such that the screening layer extends over portions of the leadframe.

11. The method according to claim 10 , wherein applying the screening layer comprises the use of pad printing.

12. The method according to claim 10 , wherein applying the screening layer comprises the use of screen printing.

13. The method according to claim 10 , wherein applying the screening layer comprises the use of inkjet printing.

14. The method according to claim 10 , wherein applying the screening layer comprises the use of plastic coating.

15. The method according to claim 10 , wherein applying the screening layer comprises the use of powder coating.

16. An electromagnetic-radiation-emitting component comprising:

at least one luminescence diode chip; and

a housing with exterior side faces;

wherein the housing of the electromagnetic-radiation-emitting component comprises a housing body having a cavity, a bottom of said cavity being provided for mounting said at least one luminescence diode chip;

wherein a leadframe is encapsulated with the housing body and the luminescence diode chip is electrically conductively connected to two electrical conductors of said leadframe;

wherein the exterior side faces are at least partly inclined with respect to a plane extending perpendicularly to a mounting plane of the housing;

wherein a screening layer is applied on at least a part of the exterior side faces and is configured to screen electromagnetic radiation; and

wherein the screening layer extends over portions of the leadframe.

17. The electromagnetic-radiation-emitting component according to claim 16 , wherein the luminescence diode chip is encapsulated with an encapsulant or covered with a radiation-transmissive covering plate.

18. The electromagnetic-radiation-emitting component according to claim 16 , wherein the luminescence diode chip is disposed on the leadframe.

19. The housing according to claim 1 , wherein the screening layer comprises a reflective layer on which an absorbent layer is applied.

20. The housing according to claim 19 , wherein the absorbent layer comprises a black lacquer.

21. The housing according to claim 19 , wherein the absorbent layer comprises a black plastic.

22. The housing according to claim 1 , wherein all of the exterior side faces of the housing are provided with the screening layer.

23. The housing according to claim 22 , wherein the exterior side faces are completely covered with the screening layer.

24. The housing according to claim 1 , wherein the screening layer includes a material that reflects the electromagnetic radiation.

25. The housing according to claim 1 , wherein the screening layer includes a material that absorbs the electromagnetic radiation.