Microelectromechanical device packaging with an anchored cap and its manufacture

1. Method of manufacturing an integrated circuit, said method comprising the steps of:

forming an active component above a substrate;

forming a low dielectric region above the substrate, wherein at least a portion of the low dielectric region is disposed above the active component;

forming a protective barrier around the low dielectric region, wherein forming the protective barrier comprises forming at least a trench in the low dielectric region, depositing a thin dielectric layer in the trench, and filling a remainder of the trench with a metal; and

forming a cavity surrounding partially the active component, the low dielectric region partially surrounding the cavity, wherein the cavity is formed through excavation and filled with a gas, the low dielectric region comprising a porous material such that the excavation comprises chemically attacking a removable region in the cavity through the low dielectric region.

2. Method according to claim 1 , wherein a removable region is formed around the active component and the low dielectric region is formed around the removable region.

3. Method according to claim 1 , wherein forming the protective barrier comprises at least partially filling the trench with a dielectric material.

4. Method according to claim 1 , wherein forming the protective barrier comprises forming an upper part larger than a base part, the upper part being above the low dielectric region, the base part being at the level of the low dielectric region.

5. The method according to claim 4 , wherein the upper part is formed by an isotropic deposition process.

6. Method according to claim 1 , wherein the protective barrier is formed by a dual damascene process.

7. Method according to claim 1 , wherein the protective barrier comprises material resistant to the step of forming a cavity.

8. A method of manufacturing an integrated comprising:

forming an active component above a substrate;

forming a low dielectric region above the substrate, wherein at least a portion of the low dielectric region is disposed above the active component, the low dielectric region formed of a porous material;

forming a protective barrier around the low dielectric region, wherein forming the protective barrier comprises forming at least a trench in the low dielectric region, depositing a thin dielectric layer in the trench, and filling a remainder of the trench with a metal; and

forming a cavity partially surrounding the active component, the low dielectric region partially surrounding the cavity, wherein the cavity is formed through excavation and filled with a gas, the low dielectric region comprising a porous material such that the excavation comprising chemically attacking a removable region in the cavity through the low dielectric region.

9. The integrated circuit integrated circuit according to claim 8 , wherein a removable region is formed around the active component and the low dielectric region is formed around the removable region.

10. The integrated circuit according to claim 8 , wherein forming the protective barrier comprises forming an upper part larger than a base part, the upper part being above the low dielectric region, the base part being at the level of the low dielectric region.

11. The integrated circuit according to claim 10 , wherein the upper part is formed by an isotropic deposition process.

12. The integrated circuit according to claim 8 , wherein the protective barrier comprises material resistant to the step of forming a cavity.

13. The integrated circuit according to claim 8 , wherein the protective barrier is formed by a dual damascene process.