PCB coil for hearing aid compatibility compliance
A wireless phone includes a wireless transceiver that facilitates wireless transfer of signals containing audio information. The wireless transceiver receives signals containing audio information and a processing circuit coupled to the wireless transceiver receives audio data based on the audio signals and provides output audio signals. The phone also includes a coil formed in a circuit carrying element (e.g. circuit board). The coil receives a signal based on the output audio signals from the processing circuit and, in response, provides an output signal receivable by a hearing aid that is not intelligible by a human ear. The coil may be one of multiple coils of a coil system formed in multiple layers of the circuit carrying element.
1 . A wireless phone, comprising:
a wireless transceiver configured to facilitate wireless transfer of signals containing audio information, the wireless transceiver configured to receive signals containing audio information;
a processing circuit coupled to the wireless transceiver and configured to receive audio data based on the audio signals received by the wireless transceiver and provide output audio signals based on the audio data; and
a coil formed in a circuit carrying element, the coil configured to receive a signal based on the output audio signals from the processing circuit and to at least provide an output signal receivable by a hearing aid that is not intelligible by a human ear.
2 . The wireless phone of claim 1 , wherein the coil is formed from at least one of printed circuit board etch material and copper that is at least one of printed and etched on the circuit carrying element.
3 . The wireless phone of claim 1 , wherein the circuit carrying element carries a multiplicity of circuit components, the plurality of circuit components comprising at least one die.
4 . The wireless phone of claim 1 , further comprising a plurality of coils, the plurality of coils cooperating to provide the output receivable by a hearing aid.
5 . The wireless phone of claim 4 , wherein the circuit carrying element is a multilayer circuit carrying element and at least two of the plurality of coils are formed in separate layers of the circuit carrying element.
6 . The wireless phone of claim 5 , wherein the plurality of coils are at least partially overlapping.
7 . The wireless phone of claim 5 , wherein the plurality of coils comprise coils on at least three layers of the circuit carrying element.
8 . The wireless phone of claim 5 , wherein the plurality of coils comprise coils on at least five layers of the circuit carrying element.
9 . The wireless phone of claim 4 , wherein the plurality of coils are configured to be powered by a common drive signal.
10 . The wireless phone of claim 4 , wherein at least two of the plurality of coils are on a common surface of the circuit carrying element.
11 . The wireless phone of claim 1 , wherein the coil is at least one of a rounded shape and a polygonal shape.
12 . The wireless phone of claim 1 , further comprising a receiver transducer configured to be driven by the processing circuit to provide private audible signals, the coil being driven in parallel to the receiver transducer.
13 . The wireless phone of claim 12 , further comprising at least one resistor configured to affect an amount of power provided to at least one of the receiver transducer and the coil so that the receiver transducer and the coil are driven differently.
14 . The wireless phone of claim 12 , wherein the coil and receiver transducer are further configured to be driven in series.
15 . The wireless phone of claim 1 , further comprising a receiver transducer configured to be driven by the processing circuit to provide private audible signals, the coil being driven in series with the receiver transducer.
16 . The wireless phone of claim 1 , further comprising a receiver transducer configured to be driven by the processing circuit to provide private audible signals, the coil being driven separately from the receiver transducer.
17 . The wireless phone of claim 1 , wherein at least the portion of the processing circuit configured to receive audio data based on the audio signals received by the wireless transceiver is provided on the circuit carrying element.
18 . The wireless phone of claim 1 , wherein the transceiver and the processing circuit are formed in a single chip.
19 . The wireless phone of claim 1 , further comprising a second circuit carrying element configured to carry the processing circuit.
20 . A wireless phone, comprising:
a user input device;
a wireless transceiver configured to facilitate transfer of audio signals, the wireless transceiver configured to receive audio signals;
a processing circuit coupled to the wireless transceiver and configured to receive audio data based on the audio signals received by the wireless transceiver and provide output audio signals based on the audio data; and
a coil system formed on a circuit board, the coil system comprising at least three coils formed in at least three layers of the circuit board, the coil system being configured to receive the output audio signals from the processing circuit and to provide a magnetic output signal based on the output audio signals from the processing circuit.
21 . A multilayer circuit board comprising:
a plurality of layers; and
multiple coils formed on the circuit board such that a wirelessly transmitted signal provided by the multiple coils is additive, the signal being a magnetic signal capable of transmitting audio information.
22 . The circuit board of claim 21 , further comprising dice provided on at least one of the layers.
23 . The circuit board of claim 22 , wherein the multiple coils are configured to be driven based on a signal from at least one of the dice.
24 . The circuit board of claim 21 , wherein the coils are configured to provide a signal that is detectable by a hearing aid.
25 . The circuit board of claim 21 , wherein the multiple coils are formed in different layers of the plurality of layers.