Method for patterning thin film, method and apparatus for fabricating flat panel display
Disclosed is a method and apparatus for fabricating a patterned thin film layer within a flat panel display that employs a soft mold and heat treatment in place of a photolithographic process. The disclosed method may reduce process time as well as substantially minimize pattern deformities. A method of fabricating a thin film, a method and apparatus of fabricating a flat panel display according to an embodiment of the present invention includes the steps of forming a thin film on a substrate; coating an etch-resist solution including solvent over a substrate where the thin film has been formed; aligning a soft mold on the substrate provided with the etch-resist solution; forming a patterned etch-resist layer on the thin film by forming the etch-resist solution through a first heat treatment below the vaporization temperature of the solvent while pressure is applied to the soft mold on the etch-resist solvent; separating the soft mold from the patterned etch-resist layer; solidifying the patterned etch-resist layer through a second heat treatment; and etching the thin film by using the patterned etch-resist layer as a mask.
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12 . An apparatus for fabricating a flat panel display, comprising:
a coater to coat an etch-resist solution having a solvent over a substrate on which a thin film has been formed;
a soft mold that is alignable with the substrate;
an aligning means for aligning the soft mold to the substrate;
a heating means for applying heat to the substrate; and
an etching means to etch the thin film using the patterned etch-resist layer as a mask.
13 . The apparatus of claim 12 , further comprising a pressure means for applying pressure to the soft mold aligned to the substrate.
14 . The apparatus according to claim 12 , wherein the heating means includes a means for applying to the substrate a first temperature of approximately 40° C.-60° C. for about 10 minutes.
15 . The apparatus according to claim 12 , wherein the heating means includes a means for applying a first temperature and a second temperature to the substrate, wherein the second temperature is higher than the first temperature.
16 . The apparatus according to claim 15 , wherein the means for applying a first temperature and a second temperature to the substrate includes a means for applying the second temperature of around 70° C.-120° C. for about 2 minutes.
17 . The apparatus according to claim 12 , wherein the flat panel display is one of a liquid crystal display, a field emission display, a plasma display panel, an electro-luminescence device, and a semiconductor device.
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