High current lead electrode for semiconductor device
View Patent ↗A semiconductor package that includes a lead frame riveted to pillars electrically connect to an electrode of a semiconductor die.
1. A power semiconductor package, comprising:
a semiconductor device;
at least one electrode on a surface of said semiconductor device;
a lead frame including a first surface and a second surface opposite said first surface, and an opening having a first mouth at said first surface and a second mouth at said second surface; and
a conductive pillar electrically coupled to said one electrode at one end thereof, extending through said opening, and having a rivet head at another opposing end thereof, said rivet head being peened and disposed over said second surface of said lead frame.
2. The package of claim 1 , wherein said conductive pillar is comprised of copper.
3. The package of claim 1 , wherein said pillar extends from a redistributed pad electrically coupled to said at least one electrode.
4. The package of claim 1 , wherein said lead frame includes a surface for external electrical connection.
5. The package of claim 1 , wherein said lead frame is comprised of a single piece of metal.
6. The package of claim 1 , wherein said lead frame is comprised of a laminated substrate.
7. The package of claim 1 , wherein said at least one electrode is one of a source electrode, a drain electrode and a gate electrode.
8. A power semiconductor package, comprising:
a semiconductor device;
a plurality of electrodes on a surface of said semiconductor device;
a first lead frame including a first surface and a second surface opposite said first surface, and a plurality of openings each having a first mouth at said first surface and a second mouth at said second surface;
a plurality of first conductive pillars each electrically coupled to one of said electrodes at one end thereof, extending through said openings in said first lead frame, and having a rivet head at another opposing end thereof, said rivet head peened over said second surface of said first lead frame;
a second lead frame including a first surface and a second surface opposite said first surface, and a plurality of openings each having a first mouth at said first surface and a second mouth at said second surface; and
a plurality of second conductive pillars each electrically coupled to another of said electrodes at one end thereof, extending through said openings in said second lead frame, and having a rivet head at another opposing end thereof, said rivet head peened over said second surface of said second lead frame.
9. The package of claim 8 , wherein said conductive pillars are comprised of copper.
10. The package of claim 8 , wherein each said pillar extends from a respective redistributed pad electrically coupled to at least one of said electrodes.
11. The package of claim 8 , wherein each said lead frame includes a surface for external electrical connection.
12. The package of claim 8 , wherein each said lead frame is comprised of a single piece of metal.
13. The package of claim 8 , wherein each said lead frame is comprised of a laminated substrate.
14. The package of claim 8 , wherein each said electrode is one of a source electrode, a drain electrode and a gate electrode.