Circuit board with signal layers of different dimensions to communicate signals of different frequencies

1. An apparatus comprising:

electronic devices to output signals at different frequencies;

a circuit board, the electronic devices being mounted to the circuit board, the circuit board having a first group of layers comprising:

reference plane layers;

signal layers between the reference plane layers, wherein a first of the signal layers has conductive traces having a first dimension to communicate signals at a first frequency, and a second of the signal layers has conductive traces having a second, different dimension to communicate the signals at a second, different frequency;

wherein the first and second signal layers are successive layers without any reference plane layer in between the first and second signal layers and the first of the signal layers is a first distance from at least one of the reference plane layers and the second of the signal layers is a second distance, different than the first distance, from the at least one of the reference planes, wherein the first and second distances are such that an impedance of the conductive traces of the first signal layer having the first dimension is matched to an impedance of the conductive traces of the second signal layer having the second dimension.

2. The apparatus of claim 1 , wherein the signal layers further include a third signal layer between the reference plane layers, the third layer having conductive traces having a third dimension to communicate the signals at a third frequency different from the first and second frequencies and wherein the third of the signal layers is a third distance from at least one of the reference plane layers, wherein the third distance is such that an impedance of the conductive traces of the third signal layer having the third dimension is matched to the impedance of the conductive traces of the first and second signal layers having the first and second dimensions, respectively.

3. The apparatus of claim 2 , wherein the second and third signal layers are successive layers without any reference plane layer between the second and third layers.

4. The apparatus of claim 3 , wherein the first, second, and third dimensions comprise first, second, and third widths, and wherein the second width is greater than the first and third widths.

5. The apparatus of claim 3 , wherein the second signal layer further comprises a reference trace to carry a reference voltage, wherein the reference voltage is one of a power supply voltage and ground voltage and is the same voltage as one of the reference plane layers.

6. The apparatus of claim 5 , wherein the first distance is defined between the first signal layer and a first of the reference plane layers, and the second distance is defined between the second signal layer and the first reference plane layer.

7. The apparatus of claim 6 , wherein the first distance is defined between the first signal layer and the reference trace.

8. The apparatus of claim 6 , wherein the first distance is defined between the third signal layer and a second of the reference plane layers, and the second distance is defined between the second signal layer and the second reference plane layer.

9. The apparatus of claim 8 , wherein the first distance is defined between the third signal layer and the reference trace.

10. The apparatus of claim 3 , wherein the second signal layer is without a reference trace to carry a reference voltage.

11. The apparatus of claim 1 , wherein the reference plane layers comprise any combination of power supply voltage plane layers and ground plane layers.

12. The apparatus of claim 1 , further comprising a second group of layers, wherein a number of layers in the second group is the same as a number of layers in the first group, the second group comprising:

second group reference plane layers; and

second group signal layers between the second group reference plane layers, wherein a first of the second group signal layers has conductive traces having the first dimension and a second of the second group signal layers has conductive traces having the second dimension,

wherein the first and second signal layers of the second group are successive layers without any reference plane layer therebetween and the first of the signal layers is a fourth distance from at least one of the reference plane layers and the second of the signal layers is a fifth distance, different than the third distance, from at least one of the reference planes, wherein the fourth and fifth distances are such that an impedance of the conductive traces of the first signal layer of the second group having the first dimension is matched to an impedance of the conductive traces of the second signal layer of the second group having the second dimension.

13. The apparatus of claim 1 , wherein the first dimension is a first width and the second dimension is a second width.

14. The apparatus of claim 1 , wherein the circuit board further comprises additional first groups of layers, wherein at least some of the first groups of layers have different arrangements.

15. The apparatus of claim 1 , wherein the electronic devices are associated with different applications that operate at the different frequencies.

16. The apparatus of claim 1 , wherein the first signal layer has the conductive traces to communicate signals in a first frequency range, wherein the first frequency is in the first frequency range, and the second signal layer has the conductive traces to communicate signals in a second frequency range, wherein the second frequency is in the second frequency range.

17. A circuit board comprising:

a first group of layers including:

reference plane layers;

signal layers between the reference plane layers, wherein a first of the signal layers has conductive traces having a first width to communicate signals in a first frequency range, and a second of the signal layers has conductive traces having a second, different width to communicate signals at a second, different frequency,

wherein the first and second signal layers are successive layers without any reference plane layer between the first and second signal layers and a first distance between the first of the signal layers is a first distance from at least one of the reference plane layers and the second of the signal layers is a second distance from at least one of the reference planes, wherein the first and second distances are such that an impedance of the conductive traces of the first signal layer having the first dimension is matched to an impedance of the conductive traces of the second signal layer having the second dimension;

a second group of layers including:

reference plane layers; and

signal layers between the reference plane layers of the second group, wherein a first of the signal layers in the second group has conductive traces having a first width to communicate the signals in the first frequency range, and a second of the signal layers in the second group has conductive traces having the second dimension to communicate the signals in the second frequency range,

wherein the first and second signal layers of the second group are successive layers without any reference plane layer in between the first and second signal layers of the second group and the first of the signal layers of the second group is a third distance from at least one of the reference plane layers of the second group and the second of the signal layers of the second group is a fourth distance, different than the first distance, from at least one of the reference planes of the second group wherein the third and fourth distances are such that an impedance of the conductive traces of the first signal layer of the second group having the first dimension is matched to an impedance of the conductive traces of the second signal layer of the second group having the second dimension,

wherein the first and second groups have different arrangements.

18. The circuit board of claim 17 , wherein the first and second groups share one of the reference plane layers.

19. The circuit board of claim 17 , further comprising a third group of layers including:

reference plane layers;

signal layers between the reference plane layers of the third group, wherein a first of the signal layers of the third group has conductive traces having the first width to communicate the signals in the first frequency range, and a second of the signal layers in the third group has conductive traces having the second width to communicate the signals in the second frequency range, wherein the first and second signal layers of the third group are successive layers without any reference plane layer in between the first and second signal layers of the third group.

20. The apparatus of claim 19 , wherein the third group has an identical arrangement as the first group.

21. A method of making a circuit board assembly, comprising:

mounting electronic devices that operate in different frequency ranges to a circuit board that has a first group of layers;

providing reference plane layers in the first group;

providing signal layers between the reference plane layers in the first group, wherein a first of the signal layers has conductive traces having a first width to communicate signals in a first frequency range, and a second of the signal layers has conductive traces having a second, different width to communicate signals in a second, different frequency range, wherein the first and second signal layers are successive layers without any reference plane layer in between the first and second signal layers and the first of the signal layers is a first distance from at least one of the reference plane layers and the second of the signal layers is a second distance, different than the first distance, from at least one of the reference planes, wherein the first and second distances are such that an impedance of the conductive traces of the first signal layer having the first dimension is matched to an impedance of the conductive traces of the second signal layer having the second dimension.

22. The method of claim 21 , wherein providing the electronic devices comprises providing electronic devices associated with a communications system having different applications.