IP Library Granted Patent US 7,732,244
Granted Patent B2
US 7,732,244 · App. 12/003,186 · Granted Jun 8, 2010

Method for forming light-transmitting regions

Assignee: VisEra Technologies Company Limited
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Quick Facts
Patent No.
US 7,732,244
App. No.
12/003,186
Granted
Jun 8, 2010
Kind
B2
Abstract

A method for forming a light-transmitting region comprises providing a support feature. A sacrificial layer is formed over a portion of the support feature, wherein the sacrificial layer comprises an energy-induced swelling material. A light-blocking layer is conformably formed over the support feature to cover the sacrificial layer and the support feature. The support feature, the sacrificial layer, and the light-blocking layer are subjected to an energy source to swell the sacrificial layer until bursting to thereby delaminate a portion of the light-blocking layer from the support feature and leave a light-transmitting region exposed with a portion of the support feature in the light-blocking layer. A gas flow or scrub cleaning force is provided to clean up the light-transmitting region and a top surface of the light-blocking layer remains over the support feature.

Claims (37)

1. A method for forming a light-transmitting region, comprising:

providing a support feature;

forming a sacrificial layer over a portion of the support feature, wherein the sacrificial layer comprises an energy-induced swelling material;

conformably forming a light-blocking layer over the support feature, covering the sacrificial layer and the support feature;

subjecting the support feature, the sacrificial layer, and the light-blocking layer to an energy source to swell the sacrificial layer until bursting, thereby delaminating a portion of the light-blocking layer from the support feature and leaving a light-transmitting region exposed with a portion of the support feature in the light-blocking layer; and

providing a gas flow or scrub cleaning force to clean up the light-transmitting region and a top surface of the light-blocking layer remaining over the support feature.

2. The method as claimed in claim 1 , wherein the support feature is a transparent substrate with a planar surface.

3. The method as claimed in claim 1 , wherein the support feature is a microlens with a curved portion and the sacrificial layer is formed on a part of the curved portion.

4. The method as claimed in claim 1 , wherein the light-blocking layer is formed by a sputtering method.

5. The method as claimed in claim 1 , wherein the energy source is a thermal energy source.

6. The method as claimed in claim 1 , wherein the energy-induced swelling material is a chemical foaming agent or a physical foaming agent.

7. The method as claimed in claim 1 , wherein the sacrificial layer is formed by a liquid dispenser.

8. The method as claimed in claim 1 , wherein the sacrificial layer is formed with a semispherical cross section.

9. The method as claimed in claim 1 , wherein the light-blocking layer comprises metal and functions as an electromagnetic interference (EMI) shielding layer.

10. The method as claimed in claim 1 , wherein the light-transmitting region in the light-blocking layer functions as a diaphragm region for an image sensing device.

11. A method for forming an image sensing device, comprising:

providing an image sensing structure with a microlens, wherein the microlens is formed with a curved portion;

forming a sacrificial layer over a portion of the curved portion of the microlens, wherein the sacrificial layer comprises an energy-induced swelling material;

conformably forming a light-blocking layer over the image sensing structure, covering the sacrificial layer and the microlens;

subjecting the image sensing structure, the sacrificial layer, and the light-blocking layer to an energy source to swell the sacrificial layer until bursting, thereby delaminating a portion of the light-blocking layer from the microlens and leaving a light-transmitting region in the light-blocking layer, thereby defining a diaphragm for the microlens;

providing a gas flow or scrub cleaning force to clean up the diaphragm and a top surface of the light-blocking layer remaining over the image sensing structure; and

disposing a planar substrate over the image sensing structure with the diaphragm for the microlens formed thereon, wherein the planar substrate is transparent to light.

12. The method as claimed in claim 11 , wherein the light-blocking layer is formed by a sputtering method.

13. The method as claimed in claim 11 , wherein the energy source is a thermal energy source.

14. The method as claimed in claim 11 , wherein the energy-induced swelling material is a chemical foaming agent or a physical foaming agent.

15. The method as claimed in claim 11 , wherein the sacrificial layer is formed by a liquid dispenser.

16. The method as claimed in claim 11 , wherein the sacrificial layer is formed with a semispherical cross section.

17. A method for forming an image sensing device, comprising:

providing a planar substrate, wherein the planar substrate is transparent to light;

forming a sacrificial layer over a portion of the planar substrate, wherein the sacrificial layer comprises an energy-induced swelling material;

conformably forming a light-blocking layer over the planar substrate, covering the sacrificial layer and the planar substrate;

subjecting the planar substrate, the sacrificial layer, and the light-blocking layer to an energy source to swell the sacrificial layer until bursting, thereby delaminating a portion of the light-blocking layer from the planar substrate and leaving a light-transmitting region in the light-blocking layer, wherein the light-transmitting region exposes a portion of the planar substrate;

providing a gas flow or scrub cleaning force to clean up the light-transmitting region and a top surface of the light-blocking layer remaining over the transparent substrate; and

disposing the planar substrate with a light-transmitting region in the light-blocking layer formed thereon over an image sensing structure with a microlens and the light-transmitting region defined as a diaphragm for the microlens.

18. The method as claimed in claim 17 , wherein the light-blocking layer is formed by a sputtering method and the energy source is a thermal energy source.

19. The method as claimed in claim 17 , wherein the energy-induced swelling material is a chemical foaming agent or a physical foaming agent.

20. The method as claimed in claim 17 , wherein the sacrificial layer is formed by a liquid dispenser and has a semispherical cross section.

Assignments (3)
CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNEE PREVIOUSLY RECORDED ON REEL 026563 FRAME 0895. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNEES ARE OMNIVISION TECHNOLOGIES, INC. AND VISERA TECHNOLOGIES COMPANY LIMITED. Recorded Aug 11, 2011
From: VISERA TECHNOLOGIES COMPANY LIMITED
To: OMNIVISION TECHNOLOGIES, INC.; VISERA TECHNOLOGIES COMPANY LIMITED
Reel/Frame 026736/0545 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 8, 2011
From: VISERA TECHNOLOGIES COMPANY LIMITED
To: OMNIVISION TECHNOLOGIES, INC.
Reel/Frame 026563/0895 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 20, 2007
From: CHENG, CHIEH-YUAN; LIN, TZU-HAN; ZUNG, PAI-CHUN PETER
To: VISERA TECHNOLOGIES COMPANY LIMITED
Reel/Frame 020328/0765 →
Continuity (1)
Related Publication 20090162967A1 · Jun 25, 2009