IP Library Granted Patent US 7,626,825
Granted Patent B2
US 7,626,825 · App. 12/003,225 · Granted Dec 1, 2009

Optical transmitter module

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 7,626,825
App. No.
12/003,225
Granted
Dec 1, 2009
Kind
B2
Abstract

An optical transmitter module is described. The optical transmitter module includes a lead pin for electrically connecting the inside and outside of a housing, and a flexible printed circuit board connected to the lead pin. The flexible printed circuit board has a signal pattern and two ground conductor patterns to be connected to an optical modulation element, a laser terminal pattern to be connected to a semiconductor laser, a Peltier terminal pattern to be connected to a Peltier element, and two covering conductive layers in addition to a layer on which such patterns are formed. The covering conductive layers cover all the patterns except for the signal pattern.

Claims (38)

1. An optical transmitter module comprising:

a housing that houses a semiconductor laser element, and an optical modulation element for modulating a laser beam by an electrical signal;

lead pins for electrically connecting the inside and outside of the housing; and

a flexible printed circuit board connected to the lead pins,

wherein said flexible printed circuit board includes:

a signal pattern to be connected to the optical modulation element;

first and second ground conductor patterns provided on both sides of the signal pattern;

a third ground conductor pattern provided on the back side of the signal pattern;

a first insulating layer for covering the signal pattern as well as the first and second ground conductor patterns;

a second insulating layer for covering the third ground conductor pattern;

a first covering conductive layer for covering the first insulating layer; and

a second covering conductive layer for covering the second insulting layer, and

wherein said first covering conductive layer at least has a slit formed over the portion of the signal pattern.

2. The optical transmitter module according to claim 1 ,

wherein said bit rate of the electrical signal propagating through the signal pattern is not less than 9.95 Gbits/s.

3. The optical transmitter module according to claim 1 ,

wherein said signal pattern and the third ground conductor pattern form a microstrip line.

4. The optical transmitter module according to claim 1 ,

wherein said signal pattern and the first and second ground conductor patterns form a coplanar line.

5. An optical transmitter module comprising:

a housing that houses a semiconductor laser element for modulating a laser beam by an electrical signal;

lead pins for electrically connecting the inside and outside of the housing; and

a flexible printed circuit board connected to the lead pins,

wherein said flexible printed circuit board includes:

a signal pattern to be connected to the optical modulation element;

first and second ground conductor patterns provided on both sides of the signal pattern;

a third ground conductor pattern provided on the back side of the signal pattern;

a first insulating layer for covering the signal pattern as well as the first and second ground conductor patterns;

a second insulating layer for covering the third ground conductor pattern;

a first covering conductive layer for covering the first insulating layer; and

a second covering conductive layer for covering the second insulating layer, and

wherein said first covering conductive layer at least has a slit formed over the portion of the signal pattern.

6. The optical transmitter module according to claim 5 ,

wherein said bit rate of the electrical signal propagating through the signal pattern is not less than 9.95 Gbits/s.

7. The optical transmitter module according to claim 5 ,

wherein said signal pattern and the third ground conductor pattern form a microstrip line.

8. The optical transmitter module according to claim 5 ,

wherein said signal pattern and the first and second ground conductor patterns form a coplanar line.

Assignments (4)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 17, 2025
From: LUMENTUM JAPAN, INC.
To: LUMENTUMRADIANT GMBH
Reel/Frame 073971/0379 →
CHANGE OF NAME Recorded Jul 2, 2019
From: OCLARO JAPAN, INC.
To: LUMENTUM JAPAN, INC.
Reel/Frame 049669/0609 →
CHANGE OF NAME Recorded Dec 3, 2014
From: OPNEXT JAPAN, INC.
To: OCLARO JAPAN, INC.
Reel/Frame 034524/0875 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 31, 2008
From: TAKAMATSU, HISASHI; YAMASHITA, TAKESHI; KUWANO, HIDEYUKI; KAGAYA, OSAMU; ARIMA, HIROYUKI
To: OPNEXT JAPAN, INC.
Reel/Frame 020755/0944 →