IP Library › Granted Patent US 8,053,587
Granted Patent B2
US 8,053,587 · App. 12/004,343 · Granted Nov 8, 2011

Reworkable thermosetting resin composition

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Quick Facts
Patent No.
US 8,053,587
App. No.
12/004,343
Granted
Nov 8, 2011
Kind
B2
Abstract

This invention relates to thermosetting resin compositions useful for mounting onto a circuit board semiconductor devices, such as CSPs, BGAs, LGAs and the like, each of which having a semiconductor chip, such as LSI, on a carrier substrate. The compositions of this invention are reworkable when subjected to appropriate conditions.

Claims (3)

1. A compound within the following structure:

wherein R 4 , R 5 , R 6 , R 7 , R 8 , and R 9 are individually selected from the group consisting of hydrogen, alkyl from one to eight carbon atoms, alkenyl from two to eight carbon atoms and combinations thereof, and X and X 1 may be selected from the group consisting of O and S.

2. A compound represented by:

Assignments (5)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 26, 2015
From: HENKEL US IP LLC
To: HENKEL IP & HOLDING GMBH
Reel/Frame 035100/0151 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 7, 2014
From: HENKEL CORPORATION
To: HENKEL US IP LLC
Reel/Frame 034183/0611 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 25, 2014
From: KLEMARCZYK, PHILIP T.; MESSANA, ANDREW D.; TORRES-FILHO, AFRANIO; YAEGER, ERIN K.; DOBA, TAKAHISA
To: LOCTITE CORPORATION
Reel/Frame 032755/0575 →
CHANGE OF NAME Recorded Apr 25, 2014
From: LOCTITE CORPORATION
To: HENKEL LOCTITE CORPORATION
Reel/Frame 032755/0875 →
MERGER Recorded Apr 25, 2014
From: HENKEL LOCTITE CORPORATION
To: HENKEL CORPORATION
Reel/Frame 032757/0276 →