Magnetic head design having reduced susceptibility to electrostatic discharge from media surfaces
View Patent ↗Methods and structures for the fabrication of a thin film, longitudinal and perpendicular recording heads are disclosed. The heads comprise a plurality of embedded static dissipative layers that extend a few nanometers from the air bearing surface. These extended layers are first to contact the magnetic media surface and drain any electric charge buildup before a damaging discharge occurs with read or write head components. The embedded static dissipative layers are particularly useful for use in heads utilizing thermal fly height control systems, which tend to increase the probability of damaging electrical discharge through critical head components.
1. A thin film magnetic head comprising:
a read head structure;
a write head structure, said read head structure and said write head structure sharing a common air bearing surface;
a first electrostatic dissipative layer, disposed between said read head structure and said write head structure, a portion of said first electrostatic layer extending beyond said air bearing surface by a distance D, said distance D being between 1 and 5 nm.
2. The magnetic head as recited in claim 1 , further comprising a second electrostatic dissipative layer, located such that said read head structure is disposed between said first electrostatic dissipative layer and said second electrostatic dissipative layer, a portion of said second electrostatic layer extending beyond said air bearing surface by said distance D.
3. The magnetic head as recited in claim 2 , further comprising a third electrostatic dissipative layer, located such that said write head structure is disposed between said first electrostatic dissipative layer and said third electrostatic dissipative layer, a portion of said third electrostatic layer extending beyond said air bearing surface by said distance D.
4. The magnetic head as recited in claim 3 , wherein said first, said second, and said third electrostatic dissipative layers have a sheet resistance between 10 5 and 10 11 ohms/square.
5. The magnetic head as recited in claim 3 , wherein said first, said second, and said third electrostatic dissipative layers comprise diamond like carbon.
6. The magnetic head as recited in claim 3 , wherein said first, said second, and said third electrostatic dissipative layers comprise poly-silicon.
7. The magnetic head as recited in claim 1 , further comprising a second electrostatic dissipative layer, located such that said write head structure is disposed between said first electrostatic dissipative layer and said second electrostatic dissipative layer, a portion of said second electrostatic layer extending beyond said air bearing surface by said distance D.
8. The magnetic head as recited in claim 7 , further comprising a third electrostatic dissipative layer, located such that said read head structure is disposed between said first electrostatic dissipative layer and said third electrostatic dissipative layer, a portion of said third electrostatic layer extending beyond said air bearing surface by said distance D.
9. The magnetic head as recited in claim 8 , wherein said first, said second, and said third electrostatic dissipative layers have a sheet resistance between 10 5 and 10 11 ohms/square.
10. The magnetic head as recited in claim 8 , wherein said first, said second, and said third electrostatic dissipative layers comprise diamond like carbon.
11. The magnetic head as recited in claim 8 , wherein said first, said second, and said third electrostatic dissipative layers comprise poly-silicon.
12. The magnetic head as recited in claim 1 , wherein said write head structure is a perpendicular write head.
13. The magnetic head as recited in claim 1 , wherein said write head structure is a longitudinal write head.
14. A thin film magnetic head comprising:
a read head structure;
a write head structure, said read head structure and said write head structure sharing a common air bearing surface;
a first electrostatic dissipative layer, disposed between said read head structure and said write head structure, a portion of said first electrostatic layer extending beyond said air bearing surface by a distance D, said distance D being between 1 and 5 nm;
a second electrostatic dissipative layer, located such that said read head structure is disposed between said first electrostatic dissipative layer and said second electrostatic dissipative layer, a portion of said second electrostatic layer extending beyond said air bearing surface by said distance D; and,
a third electrostatic dissipative layer, located such that said write head structure is disposed between said first electrostatic dissipative layer and said third electrostatic dissipative layer, a portion of said third electrostatic layer extending beyond said air bearing surface by said distance D.
15. The magnetic head as recited in claim 14 , wherein said first, said second, and said third electrostatic dissipative layers have a sheet resistance between 10 5 and 10 11 ohms/square.
16. The magnetic head as recited in claim 14 , wherein said first, said second, and said third electrostatic dissipative layers comprise diamond like carbon.
17. The magnetic head as recited in claim 14 , wherein said first, said second, and said third electrostatic dissipative layers comprise poly-silicon.
18. The magnetic head as recited in claim 14 , wherein said write head structure is a perpendicular write head.
19. The magnetic head as recited in claim 1 , wherein said write head structure is a longitudinal write head.