Power MISFET, semiconductor device and DC/DC converter
View Patent ↗A technique for suppressing lowering of withstand voltage and lowering of breakdown resistance and reducing a feedback capacitance of a power MISFET is provided. A lateral power MISFET that comprises a trench region whose insulating layer is formed shallower than an HV-Nwell layer is provided in the HV-Nwell layer (drift region) formed on a main surface of a semiconductor substrate in a direction from the main surface to the inside. The lateral power MISFET has an arrangement on a plane of the main surface including a source layer (source region) and a drain layer (drain region) arranged at opposite sides to each other across a gate electrode (first conducting layer), and a dummy gate electrode (second conducting layer) that is different from the gate electrode is arranged between the gate electrode and the drain layer.
1. A power MISFET comprising a semiconductor substrate having at least one main surface,
wherein, the main surface of the semiconductor substrate has a source region, a channel region, a drift region, and a drain region arranged thereon in sequence along the main surface of the semiconductor substrate,
the drift region includes a trench region which is shallower than the drift region formed therein in a direction from the main surface of the semiconductor substrate to the inside of the semiconductor substrate,
an inside of the trench region is filled with a first insulating film,
the main surface of the semiconductor substrate has:
a gate electrode layer arranged on the channel region interposing a second insulating film; and
a dummy gate electrode layer arranged on the drift region and the first insulating film interposing a third insulating film thereon,
a plane arrangement of the main surface of the semiconductor substrate is such that:
the source region and the drain region are arranged at opposite sides to each other across the gate electrode layer, and the gate electrode layer does not overlap the first insulating film, and
the dummy gate electrode layer is arranged separately from the gate electrode layer between the gate electrode layer and the drain region, an edge portion of the dummy gate electrode layer at the drain region side overlaps the first insulating film and an edge portion of the dummy gate electrode layer at the source region side overlaps the drift region, and
the dummy gate electrode layer is electrically connected with the source region.
2. The power MISFET according to claim 1 ,
wherein the gate electrode layer and the dummy gate electrode layer are formed in a same process.
3. The power MISFET according to claim 2 ,
wherein a material of the gate electrode layer and the dummy gate electrode layer is polysilicon.
4. The power MISFET according to claim 1 ,
wherein, on both side surfaces of the gate electrode layer and the dummy gate electrode layer, sidewalls are formed respectively, and among the sidewalls, those sidewalls formed at surfaces opposing to each other are contacted with each other.
5. The power MISFET according to claim 4 ,
wherein upper surfaces of the gate electrode layer and the dummy gate electrode layer,
an upper surface of the drain region, and
an upper surface of the source region have a silicide layer formed thereon.
6. The power MISFET according to claim 5 ,
wherein the silicide layer is cobalt silicide or titanium silicide.
7. The power MISFET according to claim 1 ,
wherein, on a bottom surface side of the trench region, an impurity region having a same conducting type as that of the drift region and a higher concentration than that of the drift region is formed.
8. A semiconductor device comprising a semiconductor substrate having at least one main surface,
wherein, the semiconductor substrate of a same chip includes a lateral power MISFET device and a CMOS driver device for driving the lateral power MISFET device,
in the lateral power MISFET device,
the main surface of the semiconductor substrate has a source region, a channel region, a drift region, and a drain region arranged thereon in sequence along the main surface of the semiconductor substrate,
the drift region includes a trench region which is shallower than the drift region formed therein in a direction from the main surface of the semiconductor substrate to the inside of the semiconductor substrate,
an inside of the trench region is filled with a first insulating film,
the main surface of the semiconductor substrate has:
a gate electrode layer arranged on the channel region interposing a second insulating film; and
a dummy gate electrode layer arranged on the drift region and the first insulating film interposing a third insulating film thereon,
a plane arrangement of the main surface of the semiconductor substrate is such that:
the source region and the drain region are arranged at opposite sides to each other across the gate electrode layer, and the gate electrode layer does not overlap the first insulating film, and
the dummy gate electrode layer is arranged separately from the gate electrode layer between the gate electrode layer and the drain region, an edge portion of the dummy gate electrode layer at the drain region side overlaps the first insulating film and an edge portion of the dummy gate electrode layer at the source region side overlaps the drift region, and
the dummy gate electrode layer is electrically connected with the source region.
9. The semiconductor device according to claim 8 , further comprising:
a first device isolation region that isolates a device region of the CMOS driver device from a device region of the lateral power MISFET device; and
a second device isolation region that isolates a plurality of device regions that the CMOS driver device are included,
wherein a depth of the trench region in a direction from the main surface to the inside is shallower than depths of the first device isolation region and the second device isolation region.
10. A DC/DC converter comprising a high-side switch and a low-side switch,
wherein a lateral power MISFET is used to at least either one of the high-side switch and the low-side switch,
the lateral power MISFET comprises a semiconductor substrate having at least one main surface,
the main surface of the semiconductor substrate has a source region, a channel region, a drift region, and a drain region arranged in sequence along the main surface of the semiconductor substrate,
in the drift region, a trench region which is shallower than the drift region formed therein is arranged in a direction from the main surface of the semiconductor substrate to the inside of the semiconductor substrate,
an inside of the trench region is filled with a first insulating film,
the main surface of the semiconductor substrate has:
a gate electrode layer arranged on the channel region interposing a second insulating film; and
a dummy gate electrode layer arranged on the drift region and the first insulating film interposing a third insulating film thereon,
a plane arrangement of the main surface of the semiconductor substrate is such that:
the source region and the drain region are arranged at opposite sides to each other across the gate electrode layer, and the gate electrode layer does not overlap the first insulating film, and
the dummy gate electrode layer is arranged separately from the gate electrode layer between the gate electrode layer and the drain region, an edge portion of the dummy gate electrode layer at the drain region side overlaps the first insulating film and an edge portion of the dummy gate electrode layer at the source region side overlaps the drift region, and
the dummy gate electrode layer is electrically connected with the source region.
11. The DC/DC converter according to claim 10 ,
wherein the lateral power MISFET comprises a lateral power MISFET device and a CMOS driver device for driving the lateral power MISFET device.