Integrated circuit dismounter
View Patent ↗The present invention provides a system and method for providing a improved device for dismounting integrated circuits for rework tools in the fabrication and manufacture of hard disk drives. Embodiments of the present invention include a vacuum cap with suction capabilities for dismounting the integrated circuits. The vacuum cap includes a cylindrical portion with a vacuum path for holding a rod-like vacuum cylinder which when pressurized causes the integrated circuit to dismount. Embodiments of the present invention further include a light weight aluminum heat-shield that is disposed around the vacuum cap to protect the vacuum cap from excessive heat and to preserve the suction capabilities of the vacuum cap. In one embodiment the heat shield acts as a stopper to prevent the vacuum cap from moving upwards and helps the vacuum cap from absorbing multiple mechanical stress in order to protect the vacuum cylinder from being damaged.
1. An integrated circuit dismounting device, comprising:
a vacuum cap having a cylindrical portion and a flat suction base;
a pressure applicator disposed within the cylindrical portion of the vacuum cap;
a heat shield disposed around the cylindrical portion of the vacuum cap to control upward projection movements of the vacuum cap as pressure is applied to the pressure applicator to dismount an integrated circuit; and
a thermal epoxy retainer applied to the heat shield to couple the heat shield to the vacuum cap.
2. The integrated circuit dismounting device of claim 1 , wherein the heat shield is made of a light-weight heat conductive material.
3. The integrated circuit dismounting device of claim 2 , wherein the light-weight heat conductive material is aluminum.
4. The integrated circuit dismounting device of claim 3 , wherein the heat shield absorbs excessive heat from the vacuum cap to prevent the vacuum cap from being damaged.
5. The integrated circuit dismount device of claim 4 , wherein the heat shield protects the vacuum cap from moving upwards when pressure is applied to the cylindrical receptor.
6. A dismount tool for removing semiconductor chip from a printed circuit board in a hard disk drive, the dismount tool comprising:
a vacuum cylinder;
a vacuum cap having a first cylindrical portion and a suction base, the vacuum cylinder inserted into the first cylindrical portion of the vacuum cap;
a heat shield disposed to cover the first cylindrical portion of the vacuum cap to protect the vacuum cap from being damaged by heat applied to the semiconductor chip being removed; and
a thermal epoxy fastener for attaching the heat shield to the vacuum cap.
7. The dismount tool of claim 6 , wherein the heat shield is made of a light-weight heat conductive material.
8. The dismount tool of claim 7 , wherein the heat shield is a heat stopper.
9. A method for proving a dismount tool for removing semiconductor chip from a printed circuit board in a hard disk drive, the method comprising
providing a vacuum cylinder;
providing a vacuum cap having a first cylindrical portion and a suction base, the vacuum cylinder inserted into the first cylindrical portion of the vacuum cap;
providing a heat shield disposed to cover the first cylindrical portion of the vacuum cap to protect the vacuum cap from being damaged by heat applied to the semiconductor chip being removed; and
providing a thermal epoxy fastener for attaching the heat shield to the vacuum cap.