Thin film transistor, method of manufacturing the same, and flat panel display having the same
A thin film transistor (TFT), a method of manufacturing the TFT, and a flat panel display comprising the TFT are provided. The TFT includes a gate, a gate insulating layer that contacts the gate, a channel layer that contacts the gate insulating layer and faces the gate with the gate insulating layer therebetween, a source that contacts an end of the channel layer; and a drain that contacts an other end of the channel layer, wherein the channel layer is an amorphous oxide semiconductor layer, and each of the source and the drain is a conductive oxide layer comprising an oxide semiconductor layer having a conductive impurity in the oxide semiconductor layer. A low resistance metal layer can further be included on the source and drain. A driving circuit of a unit pixel of a flat panel display includes the TFT.
1. A thin film transistor (TFT) comprising:
a gate;
a gate insulating layer contacting the gate;
a channel layer contacting the gate insulating layer on a side opposite the gate, the channel layer including an amorphous oxide semiconductor layer;
a source contacting a first end of the channel layer and consisting of a first conductive oxide layer;
a drain contacting a second end of the channel layer and consisting of a second conductive oxide layer;
a first low resistance metal layer on about the entire upper surface of the first conductive oxide layer; and
a second low resistance metal layer on about the entire upper surface of the second conductive oxide layer.
2. The TFT of claim 1 , wherein the first and second conductive oxide layers have a basic composition identical to that of the amorphous oxide semiconductor layer of the channel layer.
3. The TFT of claim 2 , wherein the channel layer is one layer selected from the group consisting of a ZnO layer, an IZO layer, and a G-I-Z-O layer.
4. The TFT of claim 1 , wherein the first and second conductive oxide layers have a basic composition different from that of the amorphous oxide semiconductor layer of the channel layer.
5. The TFT of claim 4 , wherein the channel layer is one layer selected from the group consisting of a ZnO layer, an IZO layer, and a G-I-Z-O layer.
6. The TFT of claim 1 , wherein the channel layer is one layer selected from the group consisting of a ZnO layer, an IZO layer, and a G-I-Z-O layer.
7. The TFT of claim 1 , wherein the first and second conductive oxide layers are formed from one layer selected from the group consisting of a G-I-Z-O layer, an ITO layer, an IZO layer, a ZnO layer, and a TiO layer.
8. The TFT of claim 1 , wherein the first and second conductive oxide layers include a conductive impurity.
9. The TFT of claim 8 , wherein the conductive impurity is one selected from the group consisting of Al, In, B, and Si.
10. The TFT of claim 1 , wherein the first and second low resistance metal layers include a plurality of layers.
11. The TFT of claim 1 , wherein the gate is one of above and below the channel layer.
12. The TFT of claim 1 , further comprising an etch stopper on the channel layer between the source and the drain.
13. The TFT of claim 1 , wherein the gate is one of a single layer and a plurality of layers.
14. The TFT of claim 13 , wherein the gate includes a first MO layer, a gate metal layer, and a second Mo layer.
15. The TFT of claim 14 , wherein the gate metal layer is an Al layer or an Nd layer.
16. A thin film transistor (TFT) comprising:
a gate;
a gate insulating layer on the gate;
a channel layer including an amorphous oxide semiconductor layer on the gate insulating layer, the gate insulating layer between the channel layer and the gate;
a source on a first end of the channel layer, the source consisting of a first conductive oxide layer and a first low resistance metal layer, the first low resistance metal layer covering the entire upper surface of the first conductive oxide layer; and
a drain on a second end of the channel layer, the drain consisting of a second conductive oxide layer and a second low resistance metal layer, the second low resistance metal layer covering the entire upper surface of the second conductive oxide layer.