Encapsulated imager packaging
A method and apparatus provide a leadless imager packaging structure having an integrated leadframe and a first encapsulant with an opening, which is covered by a transparent plate to form a cavity. The cavity contains an integrated circuit having a light sensitive area facing the transparent plate and which is electrically connected to the leadframe. The integrated circuit is encapsulated within the cavity by a second encapsulant.
1 . A method of making a packaging structure comprising:
forming an integrated structure comprising a leadframe and a first encapsulant, the structure having an opening therethrough;
attaching a transparent plate to the structure to cover the opening such that the leadframe, first encapsulant, and transparent plate form a cavity;
arranging an integrated circuit having a light sensitive area inside the cavity with the light sensitive area facing the transparent plate and electrically coupling the integrated circuit to the leadframe; and
encapsulating the integrated circuit inside the cavity using a second encapsulant.
2 . The method of claim 1 , wherein the light sensitive area comprises a pixel array for detecting light and wherein the pixel array is aligned with the opening and the transparent plate so that light may pass through the transparent plate and impinge upon the pixel array.
3 . The method of claim 2 , further comprising electrically coupling the leadframe to a side of the integrated circuit upon which the pixel array is located.
4 . The method of claim 1 , further comprising attaching the transparent plate to the structure using a sealant.
5 . The method of claim 1 , further comprising electrically coupling the integrated circuit to the leadframe via solder.
6 . The method of claim 1 , wherein the integrated circuit is adhered to the leadframe by a material selected from the group comprising anisotropic conductive film, anisotropic conductive paste, non-conductive film, and non-conductive paste.
7 . The method of claim 1 , further comprising filling the cavity with a transparent material.
8 . The method of claim 7 , wherein the transparent material comprises a gas.
9 . The method of claim 8 , wherein the gas comprises air.
10 . The method of claim 1 , wherein the integrated structure is formed by injection molding or transfer molding.
11 . The method of claim 1 , wherein the lead frame does not extend past an edge of the first encapsulant.
12 . The method of claim 1 , wherein the first encapsulant and the second encapsulant comprise the same material.
13 . A method of making an imager comprising:
forming an integrated structure comprising a leadframe and a first encapsulant for external electrical connection, the structure having a planar surface and comprising an opening therein, wherein the leadframe comprises conductive traces that do not extend beyond the first encapsulant;
attaching a transparent plate to the planar surface of the structure to cover the opening such that the leadframe, first encapsulant, and transparent plate form a cavity;
arranging an imager device comprising a pixel array inside the cavity such that the pixel array is facing the transparent plate;
electrically coupling the imager device to the leadframe; and
encapsulating the imager device inside the cavity using a second encapsulant.
14 . A packaging structure, comprising:
an integrated structure comprising a leadframe and a first encapsulant, the structure having an opening defined by the first encapsulant;
a transparent plate coupled to the structure over the opening such that the leadframe, first encapsulant, and transparent plate form a cavity;
an integrated circuit having a photosensitive area arranged inside the cavity such that the photosensitive area faces the transparent plate, the integrated circuit being electrically coupled to the leadframe; and
a second encapsulant encapsulating the integrated circuit inside the cavity.
15 . The packaging structure of claim 14 , wherein the integrated circuit comprises an imaging device and wherein the photosensitive area comprises a pixel array aligned with the transparent plate so that light may pass through the transparent plate and impinge upon the pixel array.
16 . The packaging structure of claim 14 , further comprising a sealant arranged between the transparent plate and the package.
17 . The packaging structure of claim 14 , further comprising a plurality of solder bumps electrically coupling the integrated circuit to the leadframe.
18 . The packaging structure of claim 14 , wherein the integrated circuit is coupled to the leadframe by a material selected from the group comprising anisotropic conductive film, anisotropic conductive paste, non-conductive film, and non-conductive paste.
19 . The packaging structure of claim 14 , further comprising a transparent material arranged in the cavity.
20 . The packaging structure of claim 19 , wherein the transparent material comprises air.
21 . The packaging structure of claim 14 , wherein the leadframe does not extend past an edge of the first encapsulant.
22 . The packaging structure of claim 14 , wherein the leadframe comprises conductive traces arranged flat against a flat surface of the first encapsulant.
23 . A packaged imager device comprising:
a molded structure comprising a leadframe and a first encapsulant, the structure comprising an opening arranged in the first encapsulant, wherein the leadframe comprises conductive traces arranged on a flat surface of the structure;
a transparent plate coupled to the structure such that the leadframe, first encapsulant, and transparent plate form a cavity;
an imaging device comprising a pixel array arranged inside the cavity such that the pixel array is facing the transparent plate; and
a second encapsulant encapsulating the integrated circuit inside the cavity.