Disk drive device
View Patent ↗In a disk drive device in which low-density gas is sealed, embodiments of the present invention help to improve joint reliability at a solder joint section between a feedthrough and an enclosure with respect to stress applied by deformation due to changes in temperature environment in use. According to one embodiment, helium gas is sealed in an interior space of an HDD. A feedthrough is solder jointed to a feedthrough mounting surface of a base. At a part with relatively large thermal stress, a width of the feedthrough mounting surface is increased, and at a part with relatively small thermal stress, a width of the feedthrough mounting surface is decreased. This prevents a crack penetrating path from being generated at the solder joint section due to the thermal stress and prevents the solder joint section from contacting pins.
1. A disk drive device comprising:
a disk;
a motor for rotating the disk;
a head for accessing the disk;
a moving mechanism for supporting and moving the head;
a base for housing the disk, the motor, the head and the moving mechanism;
a cover joined to the base; and
gas which has lower density than air sealed within an interior space which is formed by joining the base and the cover; wherein:
the disk drive further comprises a feedthrough which is solder-jointed to the base to cover an opening penetrating the base to join an outside of the device and the interior space and is connected electrically to a wiring arranged in the interior space;
the base has a mounting surface on which the feedthrough is mounted around the opening;
the feedthrough includes a flange whose outline is larger than the opening and pins which are fixed to the flange and are electrically connected to the wiring;
a rim part of the flange is solder-jointed to the mounting surface; and
the solder-jointed mounting surface has a first part and a second part whose width is larger than the one of the first part, and thermal stress at the solder joint section of the second part is larger than the one of the first part.
2. The disk drive device according to claim 1 , wherein the solder joint section at the second part are solder-jointed to respective two points on the flange, and the distance therebetween is the maximum dimension in the flange.
3. The disk drive device according to claim 1 , wherein a solder thickness of the solder joint section at the second part is larger than a solder thickness of the solder joint section at the first part.
4. A disk drive device comprising:
a disk;
a motor for rotating the disk;
a head for accessing the disk;
a moving mechanism for supporting and moving the head;
a base for housing the disk, the motor, the head and the moving mechanism;
a cover joined to the base; and
gas which has lower density than air sealed within an interior space which is formed by joining the base and the cover; wherein
the disk drive further comprises a feedthrough which is solder jointed to the base to cover an opening penetrating the base to join an outside of the device and the interior space and is connected via circuitry to a wiring arranged in the interior space;
the base has a mounting surface on which the feedthrough is mounted around the opening;
the feedthrough includes a flange whose outline is larger than the opening and pins which are fixed to the flange and are connected to the wiring;
a rim part of the flange is solder-jointed to the mounting surface; and
the solder-jointed mounting surface has a first part and a second part, thermal stress at the solder joint section of the second part being larger than the one at the solder joint section of the first part and a solder thickness of the solder joint section of the second part being larger than the one of the solder joint section of the first part.
5. The disk drive device according to claim 4 , wherein the mounting surface has depressed parts and projected parts so that the thicknesses of the solder joint sections of the first part and the second part are different.
6. The disk drive device according to claim 4 , wherein the solder joint section at the second part are solder-jointed to respective two points on the flange, and the distance therebetween is the maximum dimension in the flange.