IP Library Granted Patent US 7,833,019
Granted Patent B2
US 7,833,019 · App. 12/011,103 · Granted Nov 16, 2010

Spring beam wafer connector

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 7,833,019
App. No.
12/011,103
Granted
Nov 16, 2010
Kind
B2
Abstract

A multi-contact electrical connector wafer includes an insulating base and at least one bay on a first side of the base. A conductor is associated with the at least one bay and the conductor is adapted to contact a corresponding mating element. The wafer further includes a loading beam adapted to bias the first conductor toward the corresponding mating element upon deflection of the beam. A connector may be formed with a conductive component disposed in a connector housing defining a receptacle opening. The conductive component is arranged in the housing in a manner to allow the conductive component to move relative to the housing. As such, the connector can accommodate a mating connector of a first thickness or a mating connector of a second, different thickness. The connector may also be adapted to accommodate a mating connector that is inserted into the receptacle in a manner that is not collinear with respect to the receptacle.

Claims (30)

1. A multi-contact electrical connector wafer comprising:

an insulating base, the insulating base defining at least a first bay;

a flexible conductor associated with the first bay and wound at least once around a circumference of the insulating base associated with the first bay, the conductor being adapted to contact a corresponding mating element; and

a loading beam adapted to bias the conductor toward the corresponding mating element upon deflection of the beam.

2. The connector wafer of claim 1 , wherein the at least a first bay comprises a plurality of bays.

3. The connector wafer of claim 1 , wherein the loading beam is disposed adjacent the base in a direction transverse to a contact force of the conductor on the mating element.

4. The connector wafer of claim 1 , wherein the loading beam is held relative to the base in a tension-free manner.

5. The connector wafer of claim 1 , wherein the material of the loading beam is one of stainless steel, Nitinol, and spring steel.

6. The connector wafer of claim 2 , wherein contact of the conductor associated with the first bay causes a portion of the beam corresponding to the first bay to deflect in one direction and causes a portion of the beam corresponding to an adjacent bay to deflect in an opposite direction to force an elevation of a conductor associated with the adjacent bay.

7. The connector wafer of claim 1 , wherein the loading beam is coated with at least one of PTFE and nickel.

8. The connector wafer of claim 1 , wherein the conductor comprises a high conductivity copper alloy.

9. The connector wafer of claim 1 , wherein the loading beam has a cross-section that is approximately round.

10. The connector wafer of claim 1 , wherein the loading beam has a cross-section that is approximately oval.

11. The connector wafer of claim 2 , wherein the flexible conductor is further associated with at least a second bay.

12. The connector wafer of claim 2 , wherein a second flexible conductor is associated with at least a second bay.

13. The connector wafer of claim 6 wherein the conductor associated with the first bay and the conductor associated with the adjacent bay are a single conductor.

14. The connector wafer of claim 6 wherein the conductor associated with the first bay and the conductor associated with the adjacent bay are different conductors.

15. A multi-contact electrical connector wafer comprising:

an insulating base, the insulating base defining a plurality of bays, each of the plurality of bays comprising a region defined by a unique pair of end portions and a core coupling the unique pair of end portions, the core being spaced from the periphery of the unique pair of end portions;

a flexible conductor associated with a first of the plurality of bays and wound around the core corresponding to the first of the plurality of bays, the conductor being adapted to contact a corresponding mating element; and

a loading beam adapted to bias the conductor toward the corresponding mating element upon deflection of the beam.

16. The connector wafer of claim 15 , wherein the loading beam is disposed adjacent the base in a direction transverse to a contact force of the conductor on the mating element.

17. The connector wafer of claim 15 , wherein the loading beam is held relative to the base in a tension-free manner.

18. The connector wafer of claim 15 , wherein contact of the conductor associated with the first bay causes a portion of the beam corresponding to the first bay to deflect in one direction and causes a portion of the beam corresponding to an adjacent bay to deflect in an opposite direction to force an elevation of a conductor associated with the adjacent bay.

19. The connector wafer of claim 15 , wherein the loading beam has a cross-section that is approximately round.

20. The connector wafer of claim 15 , wherein the loading beam has a cross-section that is approximately oval.

21. The connector wafer of claim 15 , wherein the flexible conductor is further associated with at least a second bay.

22. The connector wafer of claim 15 , wherein a second flexible conductor is associated with at least a second bay.

23. The connector wafer of claim 18 wherein the conductor associated with the first bay and the conductor associated with the adjacent bay are a single conductor.

24. The connector wafer of claim 18 wherein the conductor associated with the first bay and the conductor associated with the adjacent bay are different conductors.

Assignments (3)
SECURITY INTEREST Recorded Jul 11, 2024
From: METHODE ELECTRONICS, INC.
To: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 068275/0875 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 20, 2008
From: TRIBOTEK, INC. (DELAWARE CORPORATION)
To: METHODE ELECTRONICS, INC.
Reel/Frame 021127/0342 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 24, 2008
From: WALLACE, ANDREW; KELLY, MICHAEL
To: TRIBOTEK, INC.
Reel/Frame 020499/0567 →