Semiconductor device, method of manufacturing semiconductor device, and electronic apparatus
A semiconductor device includes a substrate having a resin layer on at least a surface thereof; a thin-film circuit layer provided on the substrate, and a reinforcing section provided on the surface of the substrate so as to surround the thin-film circuit layer.
1. A semiconductor device comprising:
a substrate with a resin layer on at least a surface thereof;
a thin-film circuit layer provided on the substrate, the thin-film circuit layer including a thin-film transistor and an insulation layer covering the thin-film transistor; and
a first reinforcing section provided on the surface of the insulation layer, the first reinforcing section being provided along a periphery of the substrate in plan view.
2. The semiconductor device according to claim 1 , wherein the first reinforcing section is a protrusion provided on the surface of the insulation layer.
3. The semiconductor device according to claim 1 , wherein:
a second reinforcing section is provided on a region of the insulation layer outside the first reinforcing section; and
the first reinforcing section and the second reinforcing section are provided in a multilayered manner.
4. The semiconductor device according to claim 3 , wherein:
the substrate is of a rectangular shape; and
the second reinforcing section is provided over a region of the substrate including the corner of the substrate.
5. An electronic apparatus comprising the semiconductor device according to claim 1 installed therein.
6. The semiconductor device according to claim 1 , wherein:
the substrate is of a rectangular shape; and
the first reinforcing section is provided over a region of the substrate including a corner of the substrate.