Metal-coated polyimide film

1. A metal-coated polyimide film comprising: a non-thermoplastic polyimide film; and a metal layer being directly formed on one surface or both surfaces of the non-thermoplastic polyimide film without using an adhesive, wherein the non-thermoplastic polyimide film contains a non-thermoplastic polyimide resin having a thermoplastic polyimide block component, and the non-thermoplastic polyimide film, when fixed onto a metal frame and heated for 450° C. for one minute, retains its original film shape.

2. The metal-coated polyimide film according to claim 1 , wherein the thermoplastic block component is present in an amount of 20 to 60 mol % of the entire non-thermoplastic polyimide resin.

3. The metal-coated polyimide film according to claim 1 , wherein the diamine component in the thermoplastic polyimide block component contains 2,2-bis(4-aminophenoxyphenyl) propane.

4. The metal-coated polyimide film according to claim 1 , wherein the acid component in the thermoplastic polyimide block component contains a benzophenonetetracarboxylic acid and/or a biphenyltetracarboxylic acid.

5. The metal-coated polyimide film according to claim 1 , wherein the number n of repeating units of the thermoplastic polyimide block component is 3 to 99.

6. The metal-coated polyimide film according to claim 5 , wherein the number n of repeating units of the thermoplastic polyimide block component is 4 to 90.

7. The metal-coated polyimide film according to claim 1 , wherein the non-thermoplastic polyimide film is a polyimide film consisting of a non-thermoplastic polyimide resin having a thermoplastic polyimide block component.

8. The metal-coated polyimide film according to claim 1 , wherein the non-thermoplastic polyimide film further contains a filler and a non-thermoplastic polyimide resin having a thermoplastic polyimide block component.

9. The metal-coated polyimide film according to claim 8 , wherein the non-thermoplastic polyimide resin having the thermoplastic polyimide block component is 50 wt % or more of the film.

10. The metal-coated polyimide film according to claim 1 , wherein the metal layer has a metal layer A formed by a dry film forming method.

11. The metal-coated polyimide film according to claim 10 , wherein the metal layer A has: a metal layer A 1 that contacts the non-thermoplastic polyimide film; and a metal layer A 2 formed on the metal layer A 1 .

12. The metal-coated polyimide film according to claim 11 , wherein the metal layer A 1 contains at least one metal selected from the group consisting of Ni, Cu, Mo, Ta, Ti, V, Cr, Fe, and Co.

13. The metal-coated polyimide film according to claim 10 , wherein the dry film forming method is any method selected from sputtering, ion plating, and vapor deposition.

14. The metal-coated polyimide film according to claim 10 , wherein a metal layer is formed on the metal layer A by electroless plating or electroplating.

15. The metal-coated polyimide film according to claim 10 , further comprising: (i) a metal layer being formed on the metal layer A by electroless plating; and (ii) a metal layer being formed on the metal layer (i) by electroplating.

16. A flexible printed wiring board including a metal-coated polyimide film according to claim 10 .

17. A metal-coated polyimide film comprising: a base metal layer being formed on one surface or both surfaces of a non-thermoplastic polyimide film containing non-thermoplastic polyimide resin having thermoplastic polyimide block component by a dry film forming method; and a conductive layer being formed on the metal layer by at least one of sputtering, electroplating, and electroless plating, wherein the non-thermoplastic polyimide film, when fixed onto a metal frame and heated from 450° C. for one minute, retains its original film shape.

18. A method of preparing a metal-coated polyimide film comprising:

a) providing a non-thermoplastic polyimide film containing a non-thermoplastic polyimide resin having a thermoplastic polyimide block component;

b) applying vacuum suction to the polyimide film; and

c) forming a metal layer directly on the polyimide film by a dry film forming method without using an adhesive, wherein the non-thermoplastic polyimide film, when fixed onto a metal frame and heated from 450° C. for one minute, retains its original film shape.

19. The method of claim 18 , wherein the dry film forming method is a method selected from sputtering, ion plating, and vapor deposition.