IP Library Granted Patent US 8,227,734
Granted Patent B2
US 8,227,734 · App. 12/012,679 · Granted Jul 24, 2012

Solid state image pickup device having optical black pixels with temperature characteristics above and below temperature characteristics of aperture pixels

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Quick Facts
Patent No.
US 8,227,734
App. No.
12/012,679
Granted
Jul 24, 2012
Kind
B2
Abstract

There is provided a solid-state imaging device including: a plurality of aperture pixels configured to be used for capturing of an image; a plurality of first light-shielded pixels configured to be shielded from light for detection of an optical black level, a temperature dependence of a dark current in the first light-shielded pixels being larger than a temperature dependence of a dark current in the aperture pixels; and a plurality of second light-shielded pixels configured to be shielded from light for detection of an optical black level, a temperature dependence of a dark current in the second light-shielded pixels being smaller than a temperature dependence of a dark current in the aperture pixels.

Claims (29)

1. A solid-state imaging device comprising:

a plurality of aperture pixels for capturing an image;

a plurality of first light-shielded pixels shielded from light for detection of a first dark current, the first light-shielded pixels having a first dark current generating rate at a given temperature that is larger than a dark current generating rate at the given temperature for the aperture pixels; and

a plurality of second light-shielded pixels shielded from light for detection of a second dark current, the second light-shielded pixels having a second dark current generating rate at the given temperature that is smaller than a dark current generating rate at the given temperature for the aperture pixels, the second light-shielded pixels having a different physical structure from the plurality of first light-shielded pixels, wherein

pixel values of the plurality of aperture pixels, the plurality of first light-shielded pixels, and the plurality of second light-shielded pixels are read out independently of each other, and a dark current for the aperture pixels is determined based on the first and second dark currents.

2. The solid-state imaging device according to claim 1 , wherein

the plurality of first light-shielded pixels are provided around the plurality of aperture pixels, and the plurality of second light-shielded pixels are provided around the plurality of first light-shielded pixels.

3. The solid-state imaging device according to claim 1 , wherein

the plurality of second light-shielded pixels are provided around the plurality of aperture pixels, and the plurality of first light-shielded pixels are provided around the plurality of second light-shielded pixels.

4. The solid-state imaging device according to claim 1 , wherein

the first light-shielded pixels each include a photoelectric conversion element and an element for reading out a pixel value from the photoelectric conversion element and transferring the pixel value, and

the second light-shielded pixels each include an element for reading out and transferring a pixel value, and the element is an element other than a photoelectric conversion element.

5. The solid-state imaging device according to claim 1 , wherein

the first light-shielded pixels and the second light-shielded pixels each include a photoelectric conversion element, and an area of the photoelectric conversion elements in the first light-shielded pixels is larger than an area of the photoelectric conversion elements in the second light-shielded pixels.

6. The solid-state imaging device according to claim 1 , wherein

the first light-shielded pixels and the second light-shielded pixels each include a photoelectric conversion element, and an impurity concentration in the photoelectric conversion elements in the first light-shielded pixels is higher than an impurity concentration in the photoelectric conversion elements in the second light-shielded pixels.

7. The solid-state imaging device according to claim 1 , wherein

the first light-shielded pixels and the second light-shielded pixels each include a floating diffusion, and an area of the floating diffusions in the first light-shielded pixels is larger than an area of the floating diffusions in the second light-shielded pixels.

8. The solid-state imaging device according to claim 1 , wherein

the first light-shielded pixels and the second light-shielded pixels each include a floating diffusion, and an impurity concentration in the floating diffusions in the first light-shielded pixels is higher than an impurity concentration in the floating diffusions in the second light-shielded pixels.

9. An imaging apparatus comprising:

a solid-state imaging device;

a controller configured to control the solid-state imaging device; and

wherein

the solid-state imaging device includes:

a plurality of aperture pixels that are used for capturing of an image;

a plurality of first light-shielded pixels that are shielded from light for detection of a first dark current, the first light-shielded pixels having a first dark current generating rate at a given temperature that is larger than a dark current generating rate at the given temperature for the aperture pixels; and

a plurality of second light-shielded pixels that are shielded from light for detection of a second dark current and having a second dark current generating rate at the given temperature that is smaller than a dark current generating rate at the given temperature for the aperture pixels, the second light-shielded pixels having a different physical structure from the plurality of first light-shielded pixels and

pixel values of the plurality of aperture pixels, the plurality of first light-shielded pixels, and the plurality of second light-shielded pixels are read out independently of each other, and a dark current for the aperture pixels is determined based on the first and second dark currents.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 19, 2016
From: SONY CORPORATION
To: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
Reel/Frame 040419/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 5, 2008
From: KAMEDA, SHINJIRO
To: SONY CORPORATION
Reel/Frame 020503/0757 →