Package for an electronic device

1. A device formed by a process comprising:

providing a substrate having a component;

forming a sacrificial layer over the component, the sacrificial layer including a cavity portion at least partially surrounding the component and a tunnel portion adjacent the cavity portion;

forming an encapsulation layer having a cover portion and a perimeter portion over the sacrificial layer, wherein the cover portion encapsulates the cavity portion such that the cavity portion forms a cavity within the cover portion and the perimeter portion is disposed over the tunnel portion; and

forming an access hole in the perimeter portion of the encapsulation layer, wherein the tunnel portion is formed from a different material than the cavity portion.

2. The device of claim 1 , the process further comprising etching the tunnel portion via the access hole to form a tunnel extending to the cavity portion.

3. The device of claim 2 , wherein the cavity portion forms an etch stop, such that the etch stop prevents etching of the component during etching of the tunnel portion.

4. The device of claim 2 , wherein the tunnel portion comprises gold.

5. The device of claim 2 , the process further comprising etching the cavity portion via the access hole and the tunnel.

6. The device of claim 1 , the process further comprising etching the tunnel portion and the cavity portion via the access hole using a single etching process.

7. The device of claim 1 , the process further comprising:

etching the tunnel portion via the access hole with a first etchant during a first etching process to form a tunnel; and

etching the cavity portion via the access hole and the tunnel with a second etchant during a second etching process, thereby forming the cavity.

8. The device of claim 1 , wherein the cavity portion and the tunnel portion are formed from the same material such that an etchant used to remove the tunnel portion also removes the cavity portion.

9. The device of claim 1 , wherein the access hole is formed over a portion of the tunnel portion.

10. The device of claim 1 , wherein the access hole has a slit, circular, oval, rectangular, or polygonal configuration.

11. The device of claim 1 , the process further comprising forming a second encapsulation layer over the encapsulation layer, wherein the second encapsulation layer fills the access hole.

12. The device of claim 1 , further comprising forming a first layer over the substrate, wherein a first portion of the first layer forms a portion of the component.

13. The device of claim 12 , wherein a second portion of the first layer forms the tunnel portion.

14. The device of claim 12 , further comprising forming a second layer over the substrate, wherein a portion of the second layer forms the tunnel portion.

15. The device of claim 12 , wherein the component is a Microelectromechanical Systems (MEMS) device and the first portion of the first layer forms a MEMS pad of the MEMS device.

16. The device of claim 12 , wherein the first portion of the first layer forms a contact pad of the component.

17. The device of claim 2 , wherein the tunnel portion includes a first layer and a second layer, where the first layer is etched to form the tunnel extending to the cavity portion.

18. A device comprising:

a substrate having a component positioned thereon;

an encapsulation layer having a generally planar perimeter portion surrounding a raised, generally trapazoidally-shaped cover portion, the cover portion defining a cavity that surrounds the component, the perimeter portion defining a tunnel portion underneath the perimeter portion and fluidly connected to the cavity; and

an access hole in the perimeter portion of the encapsulation layer wherein the tunnel portion is formed from a different material than the cover portion.

19. The device of claim 18 wherein the access hole has a slit, circular, oval, rectangular, or polygonal configuration.

20. The device of claim 18 further comprising a second encapsulation layer, a portion of the second encapsulation layer sealing the access hole.

21. The device of claim 18 wherein the component is a microelectromechanical systems (MEMS) device.

22. The device of claim 18 wherein the component is a surface acoustic wave (SAW) filter.