Granted Patent B2

US 7,879,512 · App. 12/018,495 · Granted Feb 1, 2011

Abstract

Claims (40)

1. A photomask comprising:

a transparent substrate;

an opaque film formed on the transparent substrate, wherein the opaque film is configured to form a device pattern with which a wafer is exposed; and

at least one pair of assist patterns formed by the opaque film, the at least one pair of assist patterns being adjacent to and separated from the device pattern on the transparent substrate, wherein a size of each assist pattern of the at least one pair of assist patterns is such that the assist pattern is not resolved on the wafer, wherein:

the device pattern extends in a first direction,

each assist pattern of the at least one pair of assist patterns extends in the first direction, and

each assist pattern of the at least one pair of assist patterns includes narrow portions and wide portions that are alternately provided.

2. The photomask according to claim 1 , wherein:

steps between the narrow portions and the wide portions are formed on at least one edge of each assist pattern of the at least one pair of assist patterns.

3. The photomask according to claim 1 , wherein:

the narrow portions and the wide portions have differences in their widths, which fall in a range of 16 nm through 40 nm, and the narrow portions and the wide portions are repeatedly provided at intervals of 400 nm.

4. The photomask according to claim 1 , wherein:

steps between the narrow portions and the wide portions are formed only on one edge of each assist pattern of the at least one pair of assist patterns, which edge is on a far side with respect to the device pattern.

5. The photomask according to claim 1 , wherein:

steps between the narrow portions and the wide portions are formed on each of both edges of each assist pattern of the at least one pair of assist patterns.

6. The photomask according to claim 1 , wherein:

on the outside of the at least one pair of assist patterns, another pair of assist patterns is formed, wherein each assist pattern of the other pair of assist patterns comprises, on each of both edges thereof, steps between narrow portions and wide portions corresponding to the narrow portions and the wide portions of each assist pattern of the at least one pair of assist patterns.

7. The photomask according to claim 1 , wherein:

on the outside of the at least one pair of assist patterns, another pair of assist patterns is formed, wherein each assist pattern of the other pair of assist patterns does not comprise any steps.

8. The photomask according to claim 1 , wherein:

the photomask comprises a halftone phase shift mask.

9. A method of manufacturing an electronic device, the method comprising the step of:

exposing a substrate in such a manner that a device pattern is formed on the substrate, wherein:

the step of forming the device pattern by exposing the substrate is performed with the use of a photomask, the photomask comprising:

a transparent substrate;

an opaque film formed on the transparent substrate, wherein the opaque film is configured to form the device pattern with which a wafer is exposed; and

at least one pair of assist patterns formed by the opaque film, the at least one pair of assist patterns being adjacent to and separated from the device pattern on the transparent substrate, wherein a size of each assist pattern of the at least one pair of assist patterns is such that the assist pattern is not resolved on the wafer, wherein:

the device pattern extends in a first direction,

each assist pattern of the at least one pair of assist patterns extends in the first direction, and

each assist pattern of the at least one pair of assist patterns includes narrow portions and wide portions that are alternately provided.

10. A method of manufacturing a photomask, wherein the photomask comprises:

a transparent substrate;

an opaque film formed on the transparent substrate, wherein the opaque film is configured to form a device pattern with which a wafer is exposed; and

at least one pair of assist patterns formed by the opaque film, the at least one pair of assist patterns being adjacent to and separated from the device pattern on the transparent substrate, wherein a size of each assist pattern of the at least one pair of assist patterns is such that the assist pattern is not resolved on the wafer, wherein:

the device pattern extends in a first direction,

each assist pattern of the at least one pair of assist patterns extends in the first direction, and

each assist pattern of the at least one pair of assist patterns includes narrow portions and wide portions that are alternately provided, the method comprising:

a measurement step of measuring an inter-pattern distance of the device patterns from pattern data;

a determination step of determining, according to the inter-pattern distance, a number of said at least one pair of assist patterns, a shape of each assist pattern, and a location for arranging each assist pattern on the photomask, by referring to a table, wherein the table comprises a relationship between the inter-pattern distance, a number of assist patterns comprising no step portions, and a location for arranging each assist pattern comprising no step portions, and a relationship between the inter-pattern distance, a number of assist patterns comprising the step portions, and a location for arranging each assist pattern comprising the step portions; and

a creation step of creating a mask pattern according to the contents determined in the determination step.

Assignments (6)