Packaging for an interferometric modulator with a curved back plate
View Patent ↗A package is made of a transparent substrate having an interferometric modulator and a back plate. A non-hermetic seal joins the back plate to the substrate to form a package, and a desiccant resides inside the package. A method of packaging an interferometric modulator includes providing a transparent substrate and manufacturing an interferometric modulator array on a backside of the substrate. A back plate includes a curved portion relative to the substrate. The curved portion is substantially throughout the back plate. The back plate is sealed to the backside of the substrate with a back seal in ambient conditions, thereby forming a package.
1. An electronic device, comprising:
a substrate comprising a first surface and a second surface, wherein the second surface is generally flat;
an array of interferometric modulators formed on the first surface of the substrate;
a back-plate sealed over the array in an ambient environment and having an interior surface and an exterior surface, the interior surface of the back-plate facing the array with a gap therebetween, the exterior surface facing away from the substrate; and
wherein a portion of at least one of the interior surface or the exterior surface is curved relative to the second surface of the substrate.
2. The electronic device of claim 1 , wherein the portion is substantially curved relative to the second surface of the substrate.
3. The electronic device of claim 1 , wherein the back-plate has a convex shape.
4. The electronic device of claim 1 , wherein the back-plate is generally bowed away from the array.
5. The electronic device of claim 1 , wherein the back-plate is curved substantially throughout.
6. The electronic device of claim 1 , wherein the back-plate comprises a central portion over the array and a peripheral portion that is sealed to the substrate, wherein the central portion is curved relative to the second surface of the substrate, and wherein the peripheral portion is generally flat.
7. The electronic device of claim 1 , further comprising a seal located between the substrate and the interior surface along edges of the interior surface.
8. The electronic device of claim 1 , further comprising a desiccant interdisposed between the interior surface of the back-plate and the substrate.
9. An electronic device, comprising:
a substrate comprising a first surface and a second surface, wherein the second surface is generally flat;
an array of interferometric modulators formed on the first surface of the substrate;
a back-plate sealed over the array in an ambient environment and having an interior surface and an exterior surface, the interior surface of the back-plate facing the array with a gap therebetween, the exterior surface facing away from the substrate; and
wherein a distance between the interior surface of the back-plate and the second surface of the substrate varies across the substrate.
10. The electronic device of claim 9 , wherein the back-plate is bound to the substrate along a periphery of the back-plate.
11. The electronic device of claim 9 , wherein the interior surface is substantially curved.
12. The electronic device of claim 9 , wherein the interior surface is recessed in a generally central area thereof.
13. The electronic device of claim 9 , wherein the back-plate has substantially the same thickness throughout.
14. The electronic device of claim 9 , wherein the back-plate comprises a curved portion.
15. The electronic device of claim 9 , wherein the back-plate is generally bowed away from the array.
16. The electronic device of claim 9 , wherein the back-plate comprises a central portion over the array and a peripheral portion that is sealed to the substrate, wherein the central portion is curved relative to the second surface of the substrate, and wherein the peripheral portion is generally flat.
17. The electronic device of claim 9 , further comprising a seal located between the substrate and the interior surface along edges of the interior surface.
18. The electronic device of claim 9 , further comprising a desiccant interdisposed between the interior surface of the back-plate and the substrate.
19. The electronic device of claim 9 , wherein the back-plate has a convex shape.
20. The electronic device of claim 1 , wherein the back-plate has substantially the same thickness throughout.