IP Library Granted Patent US 7,795,641
Granted Patent B2
US 7,795,641 · App. 12/019,904 · Granted Sep 14, 2010

Diode assembly

Assignee: RFMD (UK) Limited
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Quick Facts
Patent No.
US 7,795,641
App. No.
12/019,904
Granted
Sep 14, 2010
Kind
B2
Abstract

A diode assembly comprising first and second diodes each having a different breakdown voltage, each of the first and second diodes comprising a semiconductor substrate; an electrically conducting channel layer on the semiconductor substrate; an upper semiconductor layer on the channel layer, the upper semiconductor layer comprising a recess; first and second ohmic contacts on the upper semiconductor layer on opposite sides of the recess, the ohmic contacts being connected together to form a first diode contact; a gate electrode within the recess, the gate electrode forming a second diode contact; characterised in that the area of the recess of the first diode covered by the first gate electrode is different to the area of the recess of the second diode covered by the second gate electrode.

Claims (19)

1. A diode assembly comprising:

first and second diodes each having a different breakdown voltage, each of the first and second diodes comprising:

a semiconductor substrate;

an electrically conducting channel layer on the semiconductor substrate;

an upper semiconductor layer on the channel layer, the upper semiconductor layer comprising a recess;

first and second ohmic contacts on the upper semiconductor layer on opposite sides of the recess, the ohmic contacts being connected together to form a first diode contact;

a gate electrode within the recess, the gate electrode forming a second diode contact;

characterised in that the area of the recess of the first diode covered by the first gate electrode is different to the area of the recess of the second diode covered by the second gate electrode.

2. A diode assembly as claimed in claim 1 , wherein the first and second diodes are different portions of the semiconductor substrate.

3. A diode assembly as claimed in claim 2 , wherein the semiconductor substrate is GaAs.

4. A diode assembly as claimed in claim 1 , wherein at least one of the diodes comprises a FET.

5. A diode assembly as claimed in claim 1 , wherein the recess of at least one of the first and second diodes comprises a flat base between side walls.

6. A diode assembly as claimed in claim 5 , wherein the recess of each of the first and second diodes comprises a flat base between side walls.

7. A diode assembly as claimed in claim 6 , wherein the distance between an edge of the gate and side walls in the first and second recesses define a first distance (d 1 ) and a second distance (d 2 ) respectively, with the first distance (d 1 ) being different than the second distance (d 2 ).

8. A diode assembly as claimed in claim 7 , wherein a width of a base of the recess of the first diode is different to a width of a base of the second recess.

9. A diode assembly as claimed in claim 7 , wherein a width of the gate in the recess of the first diode is different to a width of the gate in the recess of the second diode.

10. A diode assembly as claimed in claim 1 , further comprising at least one further diode.

11. A diode assembly as claimed in claim 1 , wherein at least one of the diodes comprises a pHEMT.

12. A diode assembly as claimed in claim 1 , wherein the breakdown voltage of the first diode is associated with a reverse bias of the first diode and the breakdown voltage of the second diode is associated with a reverse bias of the second diode.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 19, 2019
From: RFMD (UK) LIMITED
To: QORVO US, INC.
Reel/Frame 051330/0388 →
CHANGE OF NAME Recorded Apr 16, 2009
From: FILTRONIC COMPOUND SEMICONDUCTORS LIMITED
To: RFMD (UK) LIMITED
Reel/Frame 022552/0462 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 11, 2008
From: ATHERTON, JOHN STEPHEN
To: FILTRONIC COMPOUND SEMICONDUCTORS LIMITED
Reel/Frame 020791/0926 →
Priority Claims (2)
GB 0701460.8 · Jan 26, 2007 · national
GB 0709698.5 · May 21, 2007 · national
Continuity (1)
Related Publication 20080179630A1 · Jul 31, 2008