Method for manufacturing a semiconductor device wherein the electrical connection between two components is provided by capillary phenomenon of a liquid conductor material in a cavity therebetween

1. A method for manufacturing a semiconductor device, comprising the steps of:

providing an electronic component to a second substrate;

bonding a second insulation film to the second substrate with an adhesive;

forming a wiring line electrically coupling an electrode of the electronic component and a terminal of the second substrate by coating a liquid material containing a conductive material,

wherein the electronic component includes:

at least a first insulation film,

a second insulation film, and

the electrode, wherein the electrode includes a first portion and a second portion, the first portion being disposed between the first insulation film and the second insulation film, and the second portion being exposed by the second insulation film,

forming a first portion of the wiring line between the electrode and the second substrate such that the first portion of the wiring line contacts opposing surfaces of the second substrate and the electrode; and

forming a second portion of the wiring line between the first insulation film and the second substrate such that the second portion of the wiring line contacts opposing surfaces of the first insulation film and the second substrate;

wherein the wiring line is formed by filing a cavity that is formed between the second portion and the second substrate with the liquid material.

2. The method for manufacturing a semiconductor device according to claim 1 , wherein the step of forming the wiring line includes coating a liquid material containing a conductive material on the second substrate, the liquid material flowing into the cavity by a capillary phenomenon.

3. The method for manufacturing a semiconductor device according to claim 2 , wherein the liquid material in the step of forming the wiring line is coated by using an inkjet method.

4. The method for manufacturing a semiconductor device according to claim 2 , wherein the step of forming the wiring line further includes performing a hydrophobic treatment to a region of the second substrate so as to increase hydrophobicity of the region with respect to the liquid material and the region does not face the cavity.

5. The method for manufacturing a semiconductor device according to claim 1 further comprising the step of removing the first substrate from the electronic component after the first substrate is irradiated with light, wherein the step of removing the first substrate is performed between the step of transferring the electronic component and the step of forming the writing line.