IP Library › Granted Patent US 7,915,538
Granted Patent B2
US 7,915,538 · App. 12/021,548 · Granted Mar 29, 2011

Multilayer wiring board and its manufacturing method

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Quick Facts
Patent No.
US 7,915,538
App. No.
12/021,548
Granted
Mar 29, 2011
Kind
B2
Abstract

A multilayer wiring board having a plurality of wiring boards in which wiring layers and resin layers in each wiring board are alternately arranged in a laminated formation. In the multilayer wiring board, all the resin layers and the wiring layers, except a resin layer in the plurality of wiring boards, are separated in a same position between the plurality of wiring boards and the resin layer is continuous in the same position.

Claims (5)

1. A multilayer wiring board, comprising:

a plurality of wiring boards in which wiring layers and resin layers in each wiring board are alternately arranged in a laminated formation,

wherein all the resin layers and the wiring layers, except a predetermined resin layer in the plurality of wiring boards, are separated in a cutting area between the plurality of wiring boards,

wherein the predetermined resin layer is continuous in the cutting area, wherein said predetermined resin layer is a first resin layer which is arranged in a lowermost position among the resin layers in each wiring board, and

wherein the first resin layer in the cutting area is arranged in an uppermost position among said resin layers and has a portion that covers an end face of at least one of other resin layers in the plurality of wiring boards.