IP Library Granted Patent US 7,555,191
Granted Patent B1
US 7,555,191 · App. 12/022,879 · Granted Jun 30, 2009

Self-locking unidirectional interposer springs for optical transceiver modules

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Quick Facts
Patent No.
US 7,555,191
App. No.
12/022,879
Granted
Jun 30, 2009
Kind
B1
Abstract

This invention relates to novel latching mechanisms for a pluggable assembly or module that comprises a communications interface between a computer processing unit and the housing of an optical transceiver (such as a XENPAK module). Such connections require multiple flexible spring configurations to ground the module housing to the CPU circuit board. Such flexible spring configurations must exhibit sufficient strength to allow for flexion upon introduction of the housing within a slot within a CPU, yet sufficient force as well to reliably maintain contact of the conductive springs on the optical transceiver to a grounding strip on the CPU circuit board. Furthermore, the springs themselves must release upon application of sufficient force as the user slides the transceiver housing from the CPU slot as well. In this manner, a more reliable manner of permitting smooth introduction of an optical transceiver housing within a CPU as well as omitting of potential damaging obstacles such as indentations or other like notches within the transceiver housing has been provided. The actual spring configuration itself is encompassed within this invention, as is the optical transceiver housing including such multiple spring configurations.

Claims (10)

1. A flexible spring device produced from a single strand of surface conductive material, wherein said device is manipulated to provide two parallel extensions with a spacer component present therebetween, wherein said spacer component has two ends thereof, and wherein each of said two ends exhibits two separate bends therein, wherein each bend is from 45 to 135° from the plane of the spacer component.

2. The spring device of claim 1 wherein each bend of said two ends is from 75 to 1150.

3. The spring device of claim 2 wherein each bend is 90°.

4. The spring device of claim 1 wherein said surface conductive material is selected from the group consisting of steel, tin, brass, metal-plated steel, metal-plated plastic, metal-painted plastic, and metal-plated brass.

5. A housing assembly for an optical transceiver for introduction within a computer processing unit receptacle, said assembly configured in a general rectangular shape having two short ends and two long ends, a first short end including a connection means for connection with a driver board within said computer processing unit, said second end configured for placement external of said computer processing unit, and said two long ends including identical peripheral edges and including identical means for introducing at least one of said flexible spring devices as in claim 1 therein on each of said two long ends, wherein said identical peripheral edges are complementary to the internal configuration of said computer processing receptacle, and wherein said flexible spring devices attached to both long ends of said housing assembly provide continuous contact to the CPU circuit board during installation of the transceiver module.

6. The housing assembly of claim 5 wherein said spring devices are made from surface conductive material selected from the group consisting of steel, tin, brass, metal-plated steel, metal-plated plastic, metal-painted plastic, and metal-plated brass.

7. The housing assembly of claim 5 wherein each of said long ends includes at least two of said flexible spring devices.

8. The housing assembly of claim 6 wherein each of said long ends includes at least two of said flexible spring devices.

9. A housing assembly for an optical transceiver for introduction within a computer processing unit receptacle, said assembly configured in a general rectangular shape having two short ends and two long ends, a first short end including a connection means for connection with a driver board within said computer processing unit, a second short end configured for placement external of said computer processing unit, and said two long ends including identical peripheral edges and including identical means for introducing identical flexible spring devices therein, wherein said identical peripheral edges are smooth and exhibit no indentations therein, wherein said identical peripheral edges are complementary to the internal configuration of said computer processing receptacle, and wherein said identical flexible spring devices attached to both long ends of said housing assembly provide continuous contact to the CPU circuit board during installation of the transceiver device.

10. The housing assembly of claim 9 wherein at least two of said identical flexible spring devices is attached to each of said long ends of said housing assembly.

Assignments (5)
PATENT RELEASE AND REASSIGNMENT Recorded Jul 5, 2022
From: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
To: II-VI INCORPORATED; MARLOW INDUSTRIES, INC.; EPIWORKS, INC.; LIGHTSMYTH TECHNOLOGIES, INC.; KAILIGHT PHOTONICS, INC.; COADNA PHOTONICS, INC.; OPTIUM CORPORATION; FINISAR CORPORATION; II-VI OPTICAL SYSTEMS, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; II-VI DELAWARE, INC.; II-VI OPTOELECTRONIC DEVICES, INC.; PHOTOP TECHNOLOGIES, INC.
Reel/Frame 060574/0001 →
SECURITY INTEREST Recorded Jul 1, 2022
From: II-VI INCORPORATED; II-VI DELAWARE, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; PHOTOP TECHNOLOGIES, INC.; COHERENT, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 060562/0254 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 1, 2020
From: FINISAR CORPORATION
To: II-VI DELAWARE, INC.
Reel/Frame 052286/0001 →
NOTICE OF GRANT OF SECURITY INTEREST IN PATENTS Recorded Sep 25, 2019
From: II-VI INCORPORATED; MARLOW INDUSTRIES, INC.; EPIWORKS, INC.; LIGHTSMYTH TECHNOLOGIES, INC.; KAILIGHT PHOTONICS, INC.; COADNA PHOTONICS, INC.; OPTIUM CORPORATION; FINISAR CORPORATION; II-VI OPTICAL SYSTEMS, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; II-VI DELAWARE, INC.; II-VI OPTOELECTRONIC DEVICES, INC.; PHOTOP TECHNOLOGIES, INC.
To: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 050484/0204 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 9, 2009
From: MOORE, JOSHUA JOHN EDWARD, MR.
To: FINISAR CORPORATION
Reel/Frame 023348/0590 →