Method of making multiconductor cable assemblies

1. A method of making a multiconductor cable assembly comprising:

arranging two or more coated wires in a side-by-side contiguous relationship to provide one or more interfacing contact areas between adjacent coated wires; and

at least partially bonding the two or more coated wires using at least one of heat-pressing, ultrasonic welding, solvent welding, laser welding, adhesive bonding, and vibration welding

wherein one or more of the coated wires comprises:

a conductor, and

a covering comprising a thermoplastic composition and the thermoplastic composition comprises:

(i) a poly(arylene ether)

(ii) a polyolefin; and

(iii) a polymeric compatibilizer

wherein the thermoplastic composition is essentially free of an alkenyl aromatic resin;

wherein the covering is disposed over the conductor.

2. The method of claim 1 , wherein the polyolefin is a continuous or co-continuous phase and wherein the poly(arylene ether) is a dispersed or co-continuous phase.

3. The method of claim 1 , wherein each coated wire is at least partially bonded to an adjacent coated wire using solvent bonding with a solvent selected from the group consisting of toluene, xylene, and combinations thereof.

4. The method of claim 3 , wherein the method further comprises evaporating the solvent at a temperature of 100-175° C.

5. The method of claim 1 , wherein the multiconductor cable assembly is a ribbon cable comprising three or more coated wires.

6. The method of claim 1 , wherein the multiconductor cable assembly is a ribbon cable comprising nine or more coated wires.

7. The method of claim 1 , wherein the multiconductor cable assembly is a ribbon cable comprising twenty or more coated wires.

8. The method of claim 1 , wherein the polyolefin is selected from the group consisting of polypropylene, high density polyethylene and combinations of polypropylene and high density polyethylene.

9. The method of claim 8 , wherein the polypropylene has a melting temperature greater than or equal to 134° C.

10. The method of claim 8 , wherein the high density polyethylene has a melting temperature greater than or equal to 124° C.

11. The method of claim 1 , wherein the polymeric compatibilizer comprises a block copolymer having a block that is a controlled distribution copolymer.

12. The method of claim 1 , wherein the polymeric compatibilizer comprises a first block copolymer having an aryl alkylene content greater than or equal to 50 weight percent based on the total weight of the first block copolymer and a second block copolymer having an aryl alkylene content less than or equal to 50 weight percent based on the total weight of the second block copolymer.

13. The method of claim 1 , wherein the polymeric compatibilizer comprises a diblock copolymer and a triblock copolymer.

14. The method of claim 1 , wherein the polymeric compatibilizer comprises a polypropylene-polystyrene graft copolymer.

15. The method of claim 1 , wherein the thermoplastic composition further comprises a flame retardant.

16. The method of claim 1 , wherein the thermoplastic composition comprises polyolefin in an amount by weight that is less than the amount of poly(arylene ether) by weight, based on a combined weight of polyolefin and poly (arylene ether).

17. The method of claim 1 , wherein the covering is disposed over the conductor by extrusion coating.

18. The method of claim 1 , wherein the thermoplastic composition can be pelletized.

19. The method of claim 1 , wherein an optional intervening layer may be disposed between the conductor and the covering.

20. The method of claim 19 , wherein the optional intervening layer is an adhesion promoting layer, a metal deactivator, a thermoplastic composition, a thermoset composition, or combination of the foregoing intervening layer materials.

21. The method of claim 1 wherein the thermoplastic composition comprises:

(i) poly(arylene ether) in an amount of 30 to 65 weight percent (wt%), with respect to the total weight of the composition,

(ii) polyolefin in an amount of 15 to 35 weight percent (wt%), with respect to the total weight of the composition; and

(iii) polymeric compatibilizer in an amount of 2 to 30 weight percent (wt%), with respect to the total weight of the composition.