IP Library Patent Application 12024401
Patent Application
App. No. 12/024,401

Methods And Compositions For Depositing Silver Onto A Metal Surface

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Quick Facts
Patent No.
US None
App. No.
12/024,401
Abstract

The current method and composition relate to depositing silver onto a metal surface using an acid selected from the group consisting of salicylic acid and salicylic acid derivatives; a source of silver ions; and an additive selected from the group consisting of polyethylene glycol, a block copolymer of polyethylene glycol and polypropylene glycol, polypropylene glycol, block copolymers based on ethylenediamine as a core derivatives of any of the foregoing and mixtures of any of the foregoing.

Claims (58)

1 . A silver deposit solution comprising:

an acid selected from the group consisting of salicylic acid and salicylic acid derivatives;

a source of silver ions; and

an additive selected from the group consisting of polyethylene glycol, a block copolymer of polyethylene glycol and polypropylene glycol, polypropylene glycol, block copolymers based on ethylenediamine as a core derivatives of any of the foregoing and mixtures of any of the foregoing.

2 . The silver deposit solution of claim 1 further comprising a mineral acid.

3 . The silver deposit solution of claim 2 wherein said mineral acid is nitric acid.

4 . The silver deposit solution of claim 3 further comprising a chelator.

5 . The silver deposit solution of claim 4 wherein the chelator is selected from the group consisting of N-(2-hydroxyethyl)ethylenediaminetriacetic acid and its salts.

6 . The silver deposit solution of claim 1 wherein said acid is 3,5-dinitro salicylic acid.

7 . The silver deposit solution of claim 1 wherein said additive is a block copolymer of polyethylene glycol and polypropylene glycol.

8 . The silver deposit solution of claim 1 wherein the source of silver ions is a silver salt.

9 . The silver deposit solution of claim 1 wherein the silver deposit solution is non-foaming.

10 . The silver deposit solution of claim 1 wherein the silver deposit solution is low foaming.

11 . The silver deposit solution of claim 1 further comprising a surfactant.

12 . The silver deposit solution of claim 11 wherein said surfactant is a phosphate ester surfactant.

13 . The silver deposit solution of claim 11 wherein said surfactant is a phosphate ester of tridecyl alcohol ethoxylate.

14 . A process of depositing silver onto a metal surface, comprising:

providing a metal surface; and

applying a silver deposit solution to the metal surface, the silver deposit solution comprising;

an acid selected from the group consisting of salicylic acid and salicylic acid derivatives;

a source of silver ions; and

an additive selected from the group consisting of polyethylene glycol, a block copolymer of polyethylene glycol and polypropylene glycol, polypropylene glycol, block copolymers based on ethylenediamine as a core, derivatives of any of the foregoing and mixtures of any of the foregoing.

15 . The process of depositing silver onto a metal surface of claim 14 wherein the metal surface is copper.

16 . The process of depositing silver onto a metal surface of claim 14 wherein the metal surface is on a printed wiring board.

17 . The process of depositing silver onto a metal surface of claim 14 wherein the metal surface is positioned vertically.

18 . The process of depositing silver onto a metal surface of claim 14 wherein the silver deposit solution is sprayed on the metal surface.

19 . The process of depositing silver onto a metal surface of claim 14 wherein the silver deposit solution is non-foaming.

20 . The process of depositing silver onto a metal surface of claim 14 wherein the silver deposit solution is low foaming

21 . A silver deposit solution comprising:

an acid selected from the group consisting of salicylic acid and salicylic acid derivatives;

a source of silver ions; and

a phosphate ester surfactant.

22 . The silver deposit solution of claim 21 further comprising a mineral acid.

23 . The silver deposit solution of claim 22 wherein said mineral acid is nitric acid.

24 . The silver deposit solution of claim 23 further comprising a chelator.

25 . The silver deposit solution of claim 24 wherein the chelator is selected from the group consisting of N-(2-hydroxyethyl)ethylenediaminetriacetic acid and its salts.

26 . The silver deposit solution of claim 21 wherein said acid is 3,5-dinitro salicylic acid.

27 . The silver deposit solution of claim 21 wherein said phosphate ester surfactant is a phosphate ester of tridecyl alcohol ethoxylate.

28 . The silver deposit solution of claim 21 wherein the source of silver ions is a silver salt.

29 . The silver deposit solution of claim 21 wherein the silver deposit solution is non-foaming.

30 . The silver deposit solution of claim 21 wherein the silver deposit solution is low foaming.

31 . A process of depositing silver onto a metal surface, comprising:

providing a metal surface; and

applying a silver deposit solution to the metal surface, the silver deposit solution comprising;

an acid selected from the group consisting of salicylic acid and salicylic acid derivatives;

a source of silver ions; and

a phosphate ester surfactant.

32 . The process of depositing silver onto a metal surface of claim 31 wherein the metal surface is copper.

33 . The process of depositing silver onto a metal surface of claim 31 wherein the metal surface is on a printed wiring board.

34 . The process of depositing silver onto a metal surface of claim 31 wherein the metal surface is positioned vertically.

35 . The process of depositing silver onto a metal surface of claim 31 wherein the silver deposit solution is sprayed on the metal surface.

36 . The process of depositing silver onto a metal surface of claim 31 wherein the silver deposit solution is non-foaming.

37 . The process of depositing silver onto a metal surface of claim 31 wherein the silver deposit solution is low foaming

38 . An aqueous silver deposit solution comprising

an acid;

a source of silver ions; and

an additional component

wherein said aqueous silver deposit solution forms less than 20 mL of foam when added to water in a graduated cylinder and agitated.

Assignments (3)
CHANGE OF NAME Recorded Aug 12, 2010
From: OMG ELECTRONIC CHEMICALS, INC.
To: OMG ELECTRONIC CHEMICALS, LLC
Reel/Frame 024830/0120 →
MERGER Recorded Apr 19, 2010
From: ELECTROCHEMICALS INC.; OMG FIDELITY, INC.
To: OMG ELECTRONIC CHEMICALS, INC.
Reel/Frame 024254/0856 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 21, 2008
From: BERNARDS, ROGER F.
To: ELECTROCHEMICALS, INC.
Reel/Frame 021267/0470 →