Differential internally matched wire-bond interface
View Patent ↗In wireless communication devices, internally matching impedance in millimeter wave packaging enables better signal retention at high frequencies in the range of 15 GHz and above. Through the use of differential wire bond signal transmission, the inherent inductance of a millimeter wave package can be matched by the capacitance of the package wire bonds if the capacitance is tailored. The capacitance can be tailored by calculating a suitable distance between wire bonds and tuning the dielectric constant of the over-mold material. A differential set of wire bonds act like a differential transmission line whose characteristic impedance can be tuned by configuring the dielectric constant of the over-mold of the millimeter wave package.
1. A high frequency interconnect comprising:
a pair of differential conductors each with a first end and a second end, wherein said first end of said pair of differential conductors attaches to a first die and said second end attaches to a second die;
a material with a dielectric constant encapsulating said pair of differential conductors;
a conductor configuration comprising a distance between said pair of differential conductors and further comprising said dielectric constant of said material; and
wherein a differential signal is transmitted across said pair of differential conductors and wherein a characteristic impedance, controlled by said conductor configuration, is maintained across said high frequency interconnect, and wherein said characteristic impedance is maintained by balancing an incremental internal inductance of said high frequency interconnect with an incremental internal capacitance of said high frequency interconnect.
2. The high frequency interconnect of claim 1 , wherein said pair of differential conductors are wire bonds.
3. The high frequency interconnect of claim 1 , wherein said pair of differential conductors are ribbon bonds.
4. A differential internally matched wire-bond interface comprising:
a die package comprising:
a die;
a first wire bond attached to said die;
a second wire bond attached to said die;
an over-mold material having a dielectric constant;
wherein said first wire bond and said second wire bond are embedded in said over-mold material;
wherein a differential radio frequency signal is transmitted through said first wire bond and said second wire bond;
wherein said differential radio frequency signal generates a transmission line effect in said first wire bond and said second wire bond; and
wherein said dielectric constant is configured to generate an incremental capacitance configured to maintain a desired characteristic impedance.
5. The internally matched wire-bond interface device of claim 4 , wherein said dielectric constant of said over-mold material is 7 and above.
6. The internally matched wire-bond interface device of claim 4 , wherein said dielectric constant of said over-mold material is in the range of 5-10.
7. The high frequency interconnect of claim 1 , wherein said dielectric constant of said over-mold material is 5 and above.
8. The internally matched wire-bond interface device of claim 4 , wherein said dielectric constant of said over-mold material is 5 and above.
9. A high frequency interconnect comprising:
a pair of differential conductors each with a first end and a second end, wherein said first end of said pair of differential conductors attaches to a first printed circuit board and said second end attaches to a second printed circuit board;
a material with a dielectric constant encapsulating said pair of differential conductors;
a conductor configuration comprising a distance between said pair of differential conductors and further comprising said dielectric constant of said material; and
wherein a differential signal is transmitted across said pair of differential conductors and wherein a characteristic impedance, controlled by said conductor configuration, is maintained across said high frequency interconnect, and wherein said characteristic impedance is maintained by balancing an incremental internal inductance of said high frequency interconnect with an incremental internal capacitance of said high frequency interconnect.
10. The high frequency interconnect of claim 9 , wherein said pair of differential conductors are wire bonds.
11. The high frequency interconnect of claim 9 , wherein said pair of differential conductors are ribbon bonds.
12. The high frequency interconnect of claim 9 , wherein said dielectric constant of said over-mold material is 5 and above.
13. A high frequency interconnect comprising:
a pair of differential conductors each with a first end and a second end, wherein said first end of said pair of differential conductors attaches to a die and said second end attaches to a printed circuit board;
a material with a dielectric constant encapsulating said pair of differential conductors;
a conductor configuration comprising a distance between said pair of differential conductors and further comprising said dielectric constant of said material; and
wherein a differential signal is transmitted across said pair of differential conductors and wherein a characteristic impedance, controlled by said conductor configuration, is maintained across said high frequency interconnect, and wherein said characteristic impedance is maintained by balancing an incremental internal inductance of said high frequency interconnect with an incremental internal capacitance of said high frequency interconnect.
14. The high frequency interconnect of claim 13 , wherein said pair of differential conductors are wire bonds.
15. The high frequency interconnect of claim 13 , wherein said pair of differential conductors are ribbon bonds.
16. The high frequency interconnect of claim 13 , wherein said dielectric constant of said over-mold material is 5 and above.