Method for manufacturing semiconductor device

1. A method for manufacturing a semiconductor device, including:

(a) forming a SiGe layer on a Si substrate;

(b) forming a Si layer on the SiGe layer;

(c) forming a dummy pattern made of SiGe in a dummy region of the Si substrate; and

(d) wet-etching and removing the SiGe layer formed under the Si layer, wherein

in the step (d), an etchant is kept to contact the dummy pattern from before a complete remove of the SiGe layer to an end of the etching.

2. The method for manufacturing a semiconductor device according to claim 1 , wherein, in the step (d), the etchant is kept to contact the dummy pattern from a beginning of the etching to an end of the etching.

3. A method for manufacturing a semiconductor device, including:

(e) forming a SiGe layer on a Si substrate;

(f) forming a Si layer on the SiGe layer;

(g) etching the Si layer and the SiGe layer partially so as to form a dummy pattern made of the SiGe layer in a dummy region of the Si substrate and form a groove exposing a lateral surface of the dummy pattern and a lateral surface of the SiGe layer in an element region; and

(h) wet-etching the SiGe layer through the groove so as to form a cavity between the Si substrate and the Si layer in the element region, wherein

in the step (h), an etchant is kept to contact the dummy pattern through the groove from a beginning of the etching to an end of the etching.

4. The method for manufacturing a semiconductor device according to claim 3 , wherein the element region is a region for forming an SOI device,

wherein a region for forming a bulk silicon device, an element isolation region, a region for forming a scrub line are prepared as well as the region for forming the SOI device on the Si substrate, and

wherein the dummy region is prepared in at least one of the region for forming the SOI device, the region for forming the bulk silicon device, the element isolation region, and the region for forming the scrub line.

5. The method for manufacturing a semiconductor device according to claim 3 , wherein, in the step (g), the dummy pattern is formed such that a part of the dummy pattern is left on the Si substrate in the dummy region even after the SiGe layer is completely removed from the Si substrate in the element region.

6. The method for manufacturing a semiconductor device according to claim 3 , further comprising:

forming an insulating film in the cavity so as to fill the cavity; and

etching and removing the dummy pattern after forming a cavity between the Si substrate and the Si layer in the element region.

7. The method for manufacturing a semiconductor device according to claim 1 , wherein the etchant is made of a mixed solution including one of HF and NH 4 F; HNO 3 ; and H 2 O.

8. The method for manufacturing a semiconductor device according to claim 1 , wherein the etchant is made of a mixed solution including CH 3 COOH; one of HF and NH 4 F; HNO 3 ; and H 2 O.