IP Library Granted Patent US 7,781,683
Granted Patent B2
US 7,781,683 · App. 12/027,533 · Granted Aug 24, 2010

Assembly for a microstimulator

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Quick Facts
Patent No.
US 7,781,683
App. No.
12/027,533
Granted
Aug 24, 2010
Kind
B2
Abstract

An electrode assembly includes an electrode electrically connected to a capacitor with a wire. An assembly carrier may be used to hold and secure at least the wire and capacitor during assembly. A method of assembly for attaching a wire to a capacitor and an electrode may include an assembly carrier for housing and securing the wire, capacitor, and electrode during assembly.

Claims (12)

1. An electrode assembly for use with a microstimulator, comprising:

an assembly comprising a cylindrical ceramic member and a cylindrical metal member, wherein a first end of the ceramic member is brazed to an inner surface of an exterior flange formed in the metal member;

a conductive electrode with hole through the center of the electrode, wherein the electrode is brazed to a second end of the ceramic member;

a conductive wire electrically connected to the electrode through the hole in the electrode; and

a capacitor within the assembly electrically connected to the wire.

2. The electrode assembly of claim 1 , wherein the formed end of the ceramic member adjoins the inner surface of the exterior flange and is brazed to metal member with the braze material wherein the ceramic member is brazed to the inner surface of the exterior flange using a braze material including titanium and nickel.

3. The electrode assembly of claim 1 , wherein at least one of the wire and the electrode is titanium.

4. The electrode assembly of claim 1 , wherein the wire includes slack material between the electrode and the capacitor.

5. The electrode assembly of claim 1 , wherein the wire is electrically connected to the electrode by laser spot welding.

6. The electrode assembly of claim 1 , wherein the wire is electrically connected to the capacitor with conductive epoxy.

7. The electrode assembly of claim 1 , wherein the wire is electrically connected to the capacitor using solder.

8. The electrode assembly of claim 1 , wherein the wire forms a bend at a site of electrical connection between the wire and the capacitor.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 5, 2008
From: HALLER, MATTHEW I; HE, TOM XIAOHAI; DAULTON, JAY
To: BOSTON SCIENTIFIC NEUROMODULATION CORPORATION
Reel/Frame 021339/0299 →