Method for forming cast flexible substrate and resultant substrate and electronic device
View Patent ↗A method for forming an electronic device provides a casting master having a casting surface, and deposits a substrate material onto the casting surface to form a flexible substrate sheet of predetermined thickness, wherein the flexible substrate sheet has a circuit-side surface that is formed against the casting surface. The flexible substrate sheet is released from the master and secured against a carrier, with the circuit-side surface facing outward. An electronic device is then formed on the circuit-side surface.
1. A method for forming an electronic device comprising:
forming a master having a casting surface;
depositing a substrate material onto the casting surface to form a flexible substrate sheet of predetermined thickness, wherein the flexible substrate sheet has a circuit-side surface that is formed against the casting surface, and a back surface;
releasing the flexible substrate sheet from the master;
securing the flexible substrate sheet against a carrier, with the circuit-side surface facing outward; and
forming the electronic device on the circuit-side surface of the flexible substrate sheet while the back surface of the flexible substrate sheet is secured against the carrier.
2. The method of claim 1 wherein the carrier is formed from glass.
3. The method of claim 1 wherein the casting surface of the master is featured with at least one indentation or protrusion.
4. The method of claim 1 wherein the substrate material is polyimide.
5. The method of claim 1 wherein the substrate material is plastic.
6. The method of claim 1 wherein the substrate material is metal.
7. The method of claim 1 wherein releasing the flexible substrate comprises cooling the master, the substrate, or both.
8. The method of claim 1 further comprising forming one or more patterns of material on the back surface prior to releasing the sheet from the master.
9. The method of claim 8 wherein the one or more patterns of material are taken from the group consisting of metals, semiconductors, and dielectrics.
10. The method of claim 8 further comprising forming one or more vias between the patterns of material formed on the back surface and the circuit-side surface.
11. The method of claim 1 wherein releasing the flexible substrate sheet comprises using a solvent.
12. The method of claim 1 wherein releasing the flexible substrate sheet comprises applying radiant energy to the substrate sheet or to the master.
13. The method of claim 1 further comprising curing the substrate material that is deposited onto the casting surface.
14. The method of claim 13 wherein curing comprises irradiating the substrate material with ultraviolet radiation.
15. The method of claim 1 wherein the predetermined thickness is less than 100 microns.
16. The method of claim 1 wherein the predetermined thickness is between about 50 and 100 microns.
17. The method of claim 1 wherein the predetermined thickness is between about 10 and 50 microns.
18. The method of claim 1 wherein depositing the substrate material comprises spin-coating.
19. The method of claim 1 wherein depositing the substrate material comprises printing the material onto the casting surface.