Cleaning method and method for manufacturing electronic device
View Patent ↗A cleaning method includes: producing an oxidizing solution by electrolysis of sulfuric acid; and cleaning a workpiece with the oxidizing solution. The oxidizing solution is heated by heat of mixing to clean the workpiece. A method for manufacturing an electronic device includes: producing a workpiece; producing an oxidizing solution by electrolysis of sulfuric acid; and cleaning the workpiece with the oxidizing solution. The oxidizing solution is heated by heat of mixing to clean the workpiece.
1. A cleaning method, comprising:
producing an oxidizing solution by electrolysis of sulfuric acid, the oxidizing solution including sulfuric acid and oxidizing substances, and the sulfuric acid having a concentration of 90% by mass or more;
generating heat of mixing by mixing the oxidizing solution with a hydrogen peroxide solution; and
cleaning a workpiece with the oxidizing solution which is heated by heat of mixing and is supplied while rotating the workpiece and discharging the oxidizing solution from a movable nozzle to the rotating workpiece,
the mixing the oxidizing solution and the hydrogen peroxide solution being performed at one of in a nozzle section having the movable nozzle and on the workpiece, and
a mixing ratio of the oxidizing solution to the hydrogen peroxide solution being in the range of 1:1 to 1:5.
2. The cleaning method according to claim 1 , wherein the oxidizing solution includes at least one of peroxomonosulfuric acid and peroxodisulfuric acid.
3. The cleaning method according to claim 1 , wherein the mixing and the generating the heat of mixing are performed before the oxidizing solution is brought into contact with the workpiece.
4. The cleaning method according to claim 3 , wherein the mixing is performed in a nozzle which discharges the oxidizing solution to the workpiece.
5. The cleaning method according to claim 1 , wherein the mixing and the generating the heat of mixing are performed after the oxidizing solution is brought into contact with the workpiece.
6. The cleaning method according to claim 1 , wherein at least one selected from the group consisting of peroxomonosulfuric acid, a salt of peroxomonosulfuric acid, peroxodisulfuric acid, and a salt of peroxodisulfuric acid is added to the oxidizing solution.
7. The cleaning method according to claim 1 , wherein an anode for the electrolysis is made of one selected from the group consisting of an insoluble anode, platinum, lead dioxide, and conductive diamond.
8. The cleaning method according to claim 1 , wherein an anode for the electrolysis is made of conductive diamond.
9. The cleaning method according to claim 1 , wherein a cathode for the electrolysis is made of one selected from the group consisting of an insoluble anode, platinum, carbon, and conductive diamond.
10. The cleaning method according to claim 1 , wherein the oxidizing solution is heated before the mixing.
11. The cleaning method according to claim 1 , wherein the oxidizing solution is brought into contact with the workpiece while moving a nozzle which discharges the oxidizing solution.
12. The cleaning method according to claim 1 , wherein the oxidizing solution is brought into contact with the workpiece while rotating a table on which the workpiece is mounted.
13. A method for manufacturing an electronic device, comprising:
forming a workpiece;
producing an oxidizing solution by electrolysis of sulfuric acid, the oxidizing solution including sulfuric acid and oxidizing substances, and the sulfuric acid having a concentration of 90% by mass or more;
generating heat of mixing by mixing the oxidizing solution with a hydrogen peroxide solution; and
cleaning the workpiece with the oxidizing solution which is heated by heat of mixing and is supplied while rotating the workpiece and discharging the oxidizing solution from a movable nozzle to the rotating workpiece,
the mixing the oxidizing solution and the hydrogen peroxide solution being performed at one of in a nozzle section having the movable nozzle and on the workpiece, and
a mixing ratio of the oxidizing solution to the hydrogen peroxide solution being in the range of 1:1 to 1:5.
14. The method for manufacturing an electronic device according to claim 13 , wherein the workpiece includes an ion-implanted resist.
15. The method for manufacturing an electronic device according to claim 14 , wherein the resist is peeled by heating the oxidizing solution to 95° C. or higher.
16. The method for manufacturing an electronic device according to claim 14 , wherein the oxidizing solution is heated to 125° C. or higher.
17. The method for manufacturing an electronic device according to claim 14 , wherein the resist is peeled by the oxidizing solution which includes the hydrogen peroxide solution with its volume ratio to 1 volume of the oxidizing solution being from 1 to 5.