IP Library Granted Patent US 8,115,213
Granted Patent B2
US 8,115,213 · App. 12/028,516 · Granted Feb 14, 2012

Semiconductor light sources, systems, and methods

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Quick Facts
Patent No.
US 8,115,213
App. No.
12/028,516
Granted
Feb 14, 2012
Kind
B2
Abstract

A light-emitting diode includes a substrate, a lower cladding layer, an active layer having a quantum well of a thirty percent concentration of indium on the lower cladding layer, and an upper cladding layer. A method of manufacturing light-emitting diodes includes forming a lower cladding layer on a substrate, forming an active layer on the lower cladding layer such that the active layer has a quantum well of thirty percent indium, forming an upper cladding layer on the active layer, and forming a metal cap on the upper cladding layer.

Claims (19)

1. A light-emitting diode, comprising:

a substrate;

a lower cladding layer;

an active layer having a quantum well without strain compensation of a thirty percent concentration of indium on the lower cladding layer; and

an upper cladding layer having a lower concentration of metal than the lower cladding layer.

2. The light-emitting diode of claim 1 , further comprising a Bragg stack between the lower cladding layer and the active layer.

3. The light-emitting diode of claim 2 , wherein the Bragg stack comprises alternating layers of indium-gallium-arsenide and indium-aluminum-arsenide.

4. The light-emitting diode of claim 1 , further comprising a strain-compensating layer between the active layer and the lower cladding layer.

5. The light-emitting diode of claim 4 , wherein the strain-compensating layer further comprises a layer of indium-gallium-arsenide-phosphorous.

6. The light-emitting diode of claim 1 , further comprising a strain-compensating layer between the active layer and the upper cladding layer.

7. The light-emitting diode of claim 1 , further comprising a top metal layer residing on a selective portion of the upper cladding layer.

8. The light-emitting diode of claim 1 , further comprising a metal layer adjacent the substrate on a side opposite the lower cladding layer.

9. The light-emitting diode of claim 1 , wherein the active layer emits light having a wavelength in a range of 1.0 to 1.1 micrometers.

10. A light-emitting diode, comprising:

a substrate;

a lower cladding layer;

an active layer having a quantum well of a thirty percent concentration of indium on the lower cladding layer;

barrier layers having tensile stress on either side of the quantum well; and

an upper cladding layer having a lower concentration of metal than the lower cladding layer.

Assignments (5)
RELEASE OF SECURITY INTEREST Recorded Feb 8, 2023
From: SILICON VALLEY BANK
To: PHOSEON TECHNOLOGY, INC.
Reel/Frame 062687/0618 →
SECURITY INTEREST Recorded Jan 13, 2017
From: PHOSEON TECHNOLOGY, INC.
To: SILICON VALLEY BANK
Reel/Frame 041365/0727 →
CORRECTIVE ASSIGNMENT TO CORRECT THE NATURE OF CONVEYANCE FROM ASSIGNMENT TO SECURITY AGREEMENT PREVIOUSLY RECORDED ON REEL 026504 FRAME 0270. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT OF THE SECURITY INTEREST. Recorded Aug 14, 2012
From: PHOSEON TECHNOLOGY, INC.
To: SILICON VALLEY BANK
Reel/Frame 028782/0457 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 17, 2011
From: PHOSEON TECHNOLOGY, INC.
To: SILICON VALLEY BANK
Reel/Frame 026504/0270 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 8, 2008
From: BRADDELL, JULES
To: PHOSEON TECHNOLOGY, INC.
Reel/Frame 020484/0371 →