Electromagnetic interference (EMI) absorbing assembly and method for use in an optical transceiver module
View Patent ↗An optical transceiver module is provided that has an EMI absorbing assembly that comprises an EMI absorbing device that is electrically grounded rather than standing in free space in the transceiver module so that the assembly absorbs both the magnetic and electrical components of the EMI. In accordance with an embodiment, the EMI absorbing assembly includes a leadframe about which an EMI absorbing material is cast. The leadframe preferably is shaped in a way that prevents or lessens the occurrence of resonant EMI modes in the transceiver module housing.
1. An electromagnetic interference (EMI) absorbing assembly for use with an optical transceiver module, the assembly comprising:
an electrically conductive leadframe, the leadframe having one or more components that are shaped and sized to make contact with one or more respective portions of a metal housing of the optical transceiver module if the EMI absorbing assembly is installed in the metal housing; and
an EMI absorbing material secured to the leadframe.
2. The EMI absorbing assembly of claim 1 , wherein the EMI absorbing assembly is a cast assembly formed by casting the EMI absorbing material on the electrically conductive leadframe.
3. The EMI absorbing assembly of claim 1 , wherein at least one of the one or more components of the leadframe includes an electrically conductive pin that is configured to pass through a printed circuit board of the optical transceiver module and make electrically conductive contact with a portion of the module housing if the EMI absorbing assembly is installed in the housing.
4. The EMI absorbing assembly of claim 1 , wherein at least one of the one or more components of the leadframe includes an electrically conductive ear having spring characteristics such that if the EMI absorbing assembly is installed in the housing, the ear springs outward against an inside surface of the module housing thereby making electrically conductive contact with the housing.
5. The EMI absorbing assembly of claim 1 , wherein the leadframe has a base portion that is non-planar in shape.
6. The EMI absorbing assembly of claim 5 , wherein the base portion of the leadframe has one or more openings formed therein, and wherein the EMI absorbing material secured to the leadframe surrounds at least the base portion of the leadframe and extends through the openings formed in the base portion of the leadframe.
7. The EMI absorbing assembly of claim 5 , wherein the non-planar shape of the base portion is configured to prevent or lessen an occurrence of resonant EMI modes in the transceiver module housing.
8. An optical transceiver module having an electromagnetic interference (EMI) system therein, the EMI system comprising:
an EMI absorbing assembly disposed within a housing of the optical transceiver module, the EMI absorbing assembly comprising:
an electrically conductive leadframe, the leadframe having one or more components that are shaped and sized to make contact with one or more respective portions of the optical transceiver module housing such that the EMI absorbing assembly is electrically grounded to the housing; and
an EMI absorbing material secured to the leadframe; and
an EMI absorbing device formed on at least one surface of the transceiver module housing, the EMI absorbing device comprising:
a wavy or corrugated surface area formed on said at least one surface of the transceiver module housing; and
an EMI absorbing material on the wavy or corrugated surface area of the housing.
9. The optical transceiver module of claim 8 , wherein the EMI absorbing device formed on said at least one surface of the transceiver module housing is in contact with the EMI absorbing assembly disposed within the transceiver module housing.
10. The optical transceiver module of claim 8 , wherein the EMI absorbing assembly is a cast assembly formed by casting the EMI absorbing material on the electrically conductive leadframe.
11. The optical transceiver module of claim 8 , wherein at least one of the one or more components of the leadframe includes an electrically conductive pin that is configured to pass through a printed circuit board of the optical transceiver module and make electrically conductive contact with a portion of the module housing if the EMI absorbing assembly is installed in the housing.
12. The optical transceiver module of claim 8 , wherein at least one of the one or more components of the leadframe includes an electrically conductive ear having spring characteristics such that if the EMI absorbing assembly is installed in the housing, the ear springs outward against an inside surface of the module housing thereby making electrically conductive contact with the housing.
13. The optical transceiver module of claim 8 , wherein the leadframe has a base portion that is non-planar in shape.
14. The optical transceiver module of claim 13 , wherein the base portion of the leadframe has one or more openings formed therein, and wherein the EMI absorbing material secured to the leadframe surrounds at least the base portion of the leadframe and extends through the openings formed in the base portion of the leadframe.
15. The optical transceiver module of claim 13 , wherein the non-planar shape of the base portion is configured to prevent or lessen an occurrence of resonant EMI modes in the transceiver module housing.
16. A method for absorbing electromagnetic interference (EMI) in an optical transceiver module, the method comprising:
providing an optical transceiver module in which an EMI absorbing assembly is to be installed;
install an EMI absorbing assembly in a housing of the optical transceiver module, the EMI absorbing assembly including an electrically conductive leadframe having an EMI absorbing material secured thereto; and
placing one or more areas on the leadframe in contact with one or more electrically conductive areas of the housing to electrically ground the leadframe to the housing of the transceiver module.
17. The method of claim 16 , wherein the EMI absorbing assembly is a cast assembly formed by casting the EMI absorbing material on the electrically conductive leadframe.
18. The method of claim 16 , wherein the leadframe includes one or more electrically conductive components that are shaped and sized to make contact with one or more areas of the housing of the optical transceiver module when the EMI absorbing assembly is installed in the housing.
19. The method of claim 18 , wherein said placing one or more areas on the leadframe in contact with one or more electrically conductive areas of the housing occurs when the EMI absorbing assembly is installed in the housing and said one or more electrically conductive components make contact with said one or more areas of the housing of the optical transceiver module.
20. The method of claim 18 , wherein at least one of said one or more components of the leadframe includes an electrically conductive pin that passes through a printed circuit board of the optical transceiver module and makes electrically conductive contact with a portion of the module housing when the EMI absorbing assembly is installed in the housing.
21. The method of claim 19 , wherein at least one of the one or more components of the leadframe includes an electrically conductive ear having spring characteristics such that when the EMI absorbing assembly is installed in the housing, the ear springs outward against an inside surface of the module housing thereby making electrically conductive contact with the housing.
22. The method of claim 16 , wherein the leadframe has a base portion that is non-planar in shape.
23. The method of claim 22 , wherein the base portion of the leadframe has one or more openings formed therein, and wherein the EMI absorbing material secured to the leadframe surrounds at least the base portion of the leadframe and extends through the openings formed in the base portion of the leadframe.
24. The method of claim 22 , wherein the non-planar shape of the base portion is configured to prevent or lessen an occurrence of resonant EMI modes in the transceiver module housing.
25. An electromagnetic interference (EMI) absorbing assembly for use with an optical transceiver module, the assembly comprising:
an electrically conductive leadframe, the leadframe having one or more components that are shaped and sized to make contact with one or more respective portions of a housing of the optical transceiver module if the EMI absorbing assembly is installed in the housing, wherein at least one of the one or more components of the leadframe includes an electrically conductive ear having spring characteristics such that if the EMI absorbing assembly is installed in the housing, the ear springs outward against an inside surface of the module housing thereby making electrically conductive contact with the housing; and
an EMI absorbing material secured to the leadframe.
26. The EMI absorbing assembly of claim 25 , wherein the EMI absorbing assembly is a cast assembly formed by casting the EMI absorbing material on the electrically conductive leadframe.
27. The EMI absorbing assembly of claim 25 , wherein at least one of the one or more components of the leadframe includes an electrically conductive pin that is configured to pass through a printed circuit board of the optical transceiver module and make electrically conductive contact with a portion of the module housing if the EMI absorbing assembly is installed in the housing.
28. An electromagnetic interference (EMI) absorbing assembly for use with an optical transceiver module, the assembly comprising:
an electrically conductive leadframe, the leadframe having one or more components that are shaped and sized to make contact with one or more respective portions of a housing of the optical transceiver module if the EMI absorbing assembly is installed in the housing, wherein the leadframe has a base portion that is non-planar in shape and that has one or more openings formed therein; and
an EMI absorbing material secured to the leadframe, and wherein the EMI absorbing material surrounds at least the base portion of the leadframe and extends through the openings formed in the base portion of the leadframe.
29. The EMI absorbing assembly of claim 28 , wherein the EMI absorbing assembly is a cast assembly formed by casting the EMI absorbing material on the electrically conductive leadframe.
30. The EMI absorbing assembly of claim 28 , wherein at least one of the one or more components of the leadframe includes an electrically conductive pin that is configured to pass through a printed circuit board of the optical transceiver module and make electrically conductive contact with a portion of the module housing if the EMI absorbing assembly is installed in the housing.
31. The EMI absorbing assembly of claim 28 , wherein the non-planar shape of the base portion is configured to prevent or lessen an occurrence of resonant EMI modes in the transceiver module housing.