Thin plate glass laminate and process for producing display device using thin plate glass laminate
View Patent ↗Provided a thin plate glass laminate of a thin plate glass substrate and a support glass substrate, which suppresses inclusion of bubbles and occurrence of convex defects due to foreign matters, from which the thin plate glass substrate and the support glass substrate are easily separated, and which is excellent in heat resistance. A process for producing a display device using the thin plate glass laminate, and a silicone for release paper for the thin plate glass laminate are also provided. A thin plate glass laminate is formed by laminating a thin plate glass substrate and a support glass substrate using a silicone resin layer having releasability and non-adhesive properties.
1. A thin plate glass laminate, which is formed by laminating a thin plate glass substrate and a support glass substrate,
wherein the thin plate glass substrate and the support glass substrate are laminated by a silicone resin layer having releasability and non-adhesive properties;
wherein the silicone resin layer is a crosslinked product formed by coating the support glass substrate with a linear polyorganosiloxane having vinyl groups at both ends and/or in its side chains, and a methyl hydrogen polysiloxane having hydrosilyl groups in its molecule, followed by heat-curing at a temperature of from 50 to 250° C. for from 5 to 60 minutes in the presence of a platinum catalyst; and
wherein a mixing ratio of the linear polyorganosiloxane and the methyl hydrogen polysiloxane is adjusted so that a molar ratio of the hydrosilyl groups to the vinyl groups is from 1.3/1 to 0.7/1.
2. The thin plate glass laminate according to claim 1 , wherein the thickness of the thin plate glass substrate is less than 0.3 mm, and the total thickness of the support glass substrate and the silicone resin layer is at least 0.5 mm.
3. The thin plate glass laminate according to claim 1 , wherein a difference between the coefficient of linear expansion of the support glass substrate and the coefficient of linear expansion of the thin plate glass substrate is at most 15×10 −7 /° C.
4. The thin plate glass laminate according to claim 1 , wherein the surface energy of the silicone resin layer is from 16 to 21 erg/cm 2 .
5. The thin plate glass laminate according to claim 1 , wherein the thin plate glass substrate and the support glass substrate are laminated by a single silicone resin layer.
6. A thin plate glass laminate, which is formed by laminating a thin plate glass substrate and a support glass substrate,
wherein the thin plate glass substrate and the support glass substrate are laminated by a silicone resin layer having releasability and non-adhesive properties;
wherein the silicone resin layer is a cured crosslinked product formed by coating the support glass substrate with a linear polyorganosiloxane having vinyl groups at both ends and/or in its side chains, and a methyl hydrogen polysiloxane having hydrosilyl groups in its molecule, followed by heat-curing at a temperature of from 50 to 250° C. for from 5 to 60 minutes in the presence of a platinum catalyst,
wherein a cohesion failure does not occur when the support glass substrate is separated from the thin plate glass substrate and resealed with another thin plate glass substrate; and
wherein a mixing ratio of the linear polyorganosiloxane and the methyl hydrogen polysiloxane is adjusted so that a molar ratio of the hydrosilyl groups to the vinyl groups is from 1.3/1 to 0.7/1.
7. A thin plate glass laminate, which is formed by laminating a thin plate glass substrate and a support glass substrate,
wherein the thin plate glass substrate and the support glass substrate are laminated by a silicone resin layer having releasability and non-adhesive properties;
wherein the silicone resin layer is a cured crosslinked product formed by coating the support glass substrate with a linear polyorganosiloxane having vinyl groups at both ends and/or in its side chains, and a methyl hydrogen polysiloxane having hydrosilyl groups in its molecule, followed by heat-curing at a temperature of from 50 to 250° C. for from 5 to 60 minutes in the presence of a platinum catalyst,
wherein the silicon resin layer has a residual adhesion ratio at least 95%; and
wherein a mixing ratio of the linear polyorganosiloxane and the methyl hydrogen polysiloxane is adjusted so that a molar ratio of the hydrosilyl groups to the vinyl groups is from 1.3/1 to 0.7/1.
8. The thin plate glass laminate according to claim 7 , wherein the silicon resin layer has a residual adhesion ratio at least 98%.