High-speed interconnects
View Patent ↗In one example embodiment, a high-speed transponder includes a printed circuit board having a set of coplanar high-speed traces, and a high-speed circuit and a package mounted to the printed circuit board. The package includes an outside housing and a second high-speed circuit positioned inside the housing. The high-speed transponder also includes a high-speed feed thru which includes an inside coplanar structure positioned inside the housing, a strip line structure positioned through the housing, and an outside coplanar structure positioned outside the housing. The second high-speed circuit is operably coupled to the inside coplanar structure, which is operably coupled to the strip line structure, which is operably coupled to the outside coplanar structure, which is operably coupled to the first high-speed circuit via the set of coplanar high-speed traces. The signal plane of the outside coplanar structure is flipped with respect to a signal plane of the inside coplanar structure.
1. A high-speed transponder comprising:
a printed circuit board comprising a set of coplanar high-speed traces;
a first package mounted to the printed circuit board, the first package comprising a first set of coplanar high-speed transmission lines;
a non-coplanar high-speed interconnect connecting the set of coplanar high-speed traces to the first set of coplanar high-speed transmission lines;
a second package mounted to the printed circuit board, the second package comprising a second set of coplanar high-speed transmission lines; and
a high-speed interconnect connecting the set of coplanar high-speed traces to the second set of coplanar high-speed transmission lines.
2. The high-speed transponder as recited in claim 1 , wherein the non-coplanar high-speed interconnect comprises one of an S/GG interconnect, an SS/GGG interconnect, or an SS/GG interconnect.
3. The high-speed transponder as recited in claim 1 , wherein the high-speed transponder is capable of transmitting high-speed signals between the first and second packages via the set of coplanar high-speed traces at speeds of about 40 G.
4. The high-speed transponder as recited in claim 1 , wherein the non-coplanar high-speed interconnect comprises:
a first plane of transmission lines connecting one or more signal transmission lines from the set of coplanar high-speed traces to one or more corresponding signal transmission lines from the first set of high-speed transmission lines; and
a second plane of transmission lines connecting one or more ground transmission lines from the set of coplanar high-speed traces to one or more corresponding ground transmission lines from the first set of high-speed transmission lines,
wherein the first plane and the second plane are substantially parallel to each other.
5. The high-speed transponder as recited in claim 1 , wherein:
the first package comprises an integrated circuit package;
the second package comprises an optoelectric circuit package; and
the high-speed interconnect comprises a high-speed feed thru with a flipped signal plane.
6. A high-speed transponder comprising:
a printed circuit board comprising a set of high-speed traces;
a first high-speed package mounted to the printed circuit board, the first high-speed package comprising a first set of high-speed transmission lines;
a first high-speed interconnect comprising a non-coplanar high-speed interconnect connecting the set of high-speed traces to the first set of high-speed transmission lines;
a second high-speed package mounted to the printed circuit board, the second high speed package comprising a second set of high speed transmission lines; and
a second high-speed interconnect connecting the set of high-speed traces to the second set of high-speed transmission lines.
7. The high-speed transponder as recited in claim 6 , wherein the transponder is capable of transmitting high-speed signals between the first and second packages via the set of high-speed traces at speeds of about 40 G.
8. The high-speed transponder as recited in claim 6 , wherein:
the first high-speed package comprises an integrated circuit package; and
the second high-speed package comprises an optoelectric circuit package.
9. The high-speed transponder as recited in claim 8 , wherein the second high-speed interconnect comprises a high-speed feed thru with a flipped signal plane.