Laminated bus bars and methods of manufacture thereof

1. A laminated bus bar assembly, comprising:

first and second subassemblies, each one of the subassemblies comprising a conductive element;

a dielectric layer intermediate the first and second subassemblies; and

a reactive hot-melt adhesive adapted to bond the first and second subassemblies to the dielectric layer, wherein the reactive hot-melt adhesive has a cleavage strength between the dielectric layer and a selected one of the first and second subassemblies of at least 1500 Newtons on a 25 millimeter by 25 millimeter sample when tested in accordance with ASTM D-1062.

2. The laminated bus bar assembly of claim 1 wherein each one of the subassemblies comprising a conductive element further comprises an insulating layer disposed about each subassembly.

3. The laminated bus bar assembly of claim 2 wherein the insulating layer comprises polyethylene terephthalate, a polyethylene terephthalate/polyvinyl fluoride, polyethylene naphthalate, polyimide, or a combination comprising at least one of the foregoing.

4. The laminated bus bar assembly of claim 1 wherein the conductive element comprises copper, tin-plated copper, aluminum, or a combination comprising at least one of the foregoing.

5. The laminated bus bar assembly of claim 1 wherein the dielectric layer comprises a flame-resistant 4 epoxy-woven glass laminate, a non-woven reinforced polyethylene terephthalate composite, a polycarbonate, a polypropylene, or a combination comprising at least one of the foregoing.

6. The laminated bus bar assembly of claim 1 , wherein the reactive hot-melt adhesive has a layer thickness of about 45 grams per square meter to about 92.5 grams per square meter.

7. A method of assembling a multilayer bus bar assembly, comprising:

coating a dielectric layer with a molten reactive hot-melt adhesive;

placing the dielectric layer between and in contact with the first and second subassemblies, wherein the first and second subassemblies comprise a conductive element; and

adhering the molten reactive hot-melt adhesive to the subassemblies by applying a pressure of at least about one bar to the multilayer bus bar assembly for at least about one minute prior to the adhesive cooling to room temperature to provide a bonding strength between the dielectric material and a selected one of the first and second subassemblies of at least 1500 Newtons on a 25 millimeter by 25 millimeter sample when tested in accordance with ASTM D-1062.

8. The method of claim 7 , wherein coating the dielectric layer with the molten reactive hot-melt adhesive comprises first heating the reactive hot melt adhesive in a solid form to form a molten liquid; and applying the molten liquid to the dielectric layer.

9. The method of claim 7 , further comprising preheating the dielectric layer.

10. The method of claim 7 , wherein curing the molten reactive hot-melt adhesive is in an absence of applied heat.

11. The method of claim 7 , wherein coating the dielectric layer comprises simultaneously coating the top and bottom surfaces.

12. The method of claim 7 , wherein coating the dielectric layer comprises roll coating the molten reactive hot-melt adhesive onto a top surface of the dielectric layer and providing a release layer on an exposed surface of the reactive hot melt adhesive; roll coating the molten reactive hot-melt adhesive onto a bottom surface of the dielectric layer; and removing the release layer prior to placing the dielectric layer between the first and second subassemblies.

13. The method of claim 7 , wherein the coating comprises feeding the dielectric layer through a hot-melt adhesive roll coating machine.

14. The method of claim 7 , wherein the reactive hot-melt adhesive is a moisture activated cross-linking adhesive.

15. The method of claim 14 , wherein the moisture activated cross-linking adhesive is a polyurethane reactive hot-melt adhesive.

16. The method of claim 14 , wherein the moisture activated cross-linking adhesive is an amorphous poly-alpha-olefin reactive hot-melt adhesive.

17. The method of claim 7 , wherein the conductive element comprises copper, tin-plated copper, aluminum, or a combination comprising at least one of the foregoing.

18. The method of claim 7 , wherein the dielectric layer comprises a flame-resistant 4 epoxy-woven glass laminate, a non-woven reinforced polyethylene terephthalate composite, a polycarbonate, a polypropylene, or a combination comprising at least one of the foregoing.

19. A multilayer bus bar made by the process of claim 7 .

20. An electrical power distribution system employing the multilayer bus bar of claim 19 .