Ducted air temperature sensor
View Patent ↗A temperature isolation duct in a computer system comprising a chassis securing a circuit board and a fan system that draws air through the chassis, and a heat-generating component is mounted on the circuit board and exposed to the air flow. The hot air duct passively directs air heated by the heat-generating component from a single hot air duct inlet in direct downstream alignment with the heat-generating component to a single hot air duct outlet. A thermal sensor is secured within, or in direct alignment with, the hot air duct near the duct outlet for sensing the temperature of air flowing through the hot air duct and generating a temperature signal. A controller is in electronic communication with the thermal sensor for receiving the temperature signal and in electronic communication with the fan system for sending a fan speed control signal.
1. A computer system, comprising:
a chassis securing a circuit board;
a fan system mounted in the chassis, wherein the fan system draws air through the chassis and establishes an airflow direction;
a heat-generating component mounted on the circuit board and exposed to the air flow;
a hot air duct passively directing air heated by the heat-generating component from a single hot air duct inlet in direct downstream alignment with the heat-generating component to a single hot air duct outlet downstream of the single hot air duct inlet, wherein the hot air duct has a length to width aspect ratio of greater than four;
a first thermal sensor secured within the hot air duct near the single hot air duct outlet for sensing the temperature of the heated air flowing through the hot air duct and generating a first temperature signal; and
a controller in electronic communication with the first thermal sensor for receiving the temperature signal from the first thermal sensor and in electronic communication with the fan system for sending a fan speed control signal to the fan system.
2. The system of claim 1 , wherein the hot air duct has a substantially uniform cross-section along the length from the single inlet to the single outlet.
3. The system of claim 1 , wherein the hot air duct is generally parallel to the airflow direction.
4. The system of claim 1 , wherein the single hot air duct outlet is adjacent a downstream edge of the circuit board.
5. The system of claim 4 , wherein the first thermal sensor is secured to the chassis downstream of the circuit board.
6. The system of claim 1 , wherein the fan speed is adjusted to control the temperature sensed by the first thermal sensor.
7. The system of claim 1 , wherein the hot air duct is secured to the circuit board.
8. The system of claim 1 , wherein the chassis selectively secures the circuit board, wherein the circuit board is selected from a plurality of circuit boards having different component layouts, and wherein each circuit board layout has a unique hot air duct that passively directs the air heated by the heat-generating component from the single hot air duct inlet into thermal communication with the first thermal sensor at a fixed position in the chassis.
9. The system of claim 1 , characterized in that the temperature sensed by the first thermal sensor experiences less temperature fluctuation than in the absence of the hot air duct.
10. The system of claim 1 , wherein the heat-generating component is selected from a hard drive, memory device and a processor.
11. The system of claim 1 , wherein the hot air duct extends through a second component on the circuit board.
12. The system of claim 11 , wherein the second component is a heat exchanger.
13. The system of claim 1 , wherein the hot air duct extends over a second component on the circuit board.
14. The system of claim 1 , wherein the hot air duct extends around a second component on the circuit board.
15. A computer system, comprising:
a chassis securing a circuit board;
a fan system mounted in the chassis, wherein the fan system draws air through the chassis and establishes an airflow direction;
a heat-generating component mounted on the circuit board and exposed to the air flow;
a hot air duct passively directing air heated by the heat-generating component from a single hot air duct inlet in direct downstream alignment with the heat-generating component to a single hot air duct outlet downstream of the single hot air duct inlet, wherein the hot air duct has a length to width aspect ratio of greater than four;
an ambient air duct passively directing ambient air from a single ambient air duct inlet in direct downstream alignment with a chassis air inlet to a single ambient air duct outlet downstream of the single inlet, wherein the ambient air duct has a length to width aspect ratio of greater than four;
a first thermal sensor secured within the hot air duct near the single hot air duct outlet for sensing the temperature of the heated air flowing through the hot air duct;
a second thermal sensor secured within the ambient air duct near the single ambient air duct outlet for sensing the temperature of the ambient air flowing through the ambient air duct; and
a controller in electronic communication with the first thermal sensor for receiving a first temperature signal from the first thermal sensor, in electronic communication with the second thermal sensor for receiving a second temperature signal from the second thermal sensor, and in electronic communication with the fan system for sending a fan speed control signal to the fan system.
16. The system of claim 15 , wherein the single hot air duct outlet and the single ambient air duct outlet are adjacent a downstream edge of the circuit board.
17. The system of claim 16 , wherein the first and second thermal sensors are secured to the chassis downstream of the circuit board.