IP Library Granted Patent US 8,011,200
Granted Patent B2
US 8,011,200 · App. 12/032,930 · Granted Sep 6, 2011

Cooling fluid flow regulation distribution system and method

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Quick Facts
Patent No.
US 8,011,200
App. No.
12/032,930
Granted
Sep 6, 2011
Kind
B2
Abstract

The disclosure provides systems and methods for regulating and distributing cooling fluid through a plurality of heat sinks, such as cold plates, using a flow regulator, which sets the total flow rate, in combination with one or more individual orifices that allow further flow distribution as required by individual cold plates, despite flow variations upstream of the orifices. An orifice can be coupled to an orifice holder, which includes a body to support the orifice, and which may be coupled (directly or indirectly) to an inlet of the cold plate. Alternative manners of coupling orifices in the fluid flow besides an orifice holder can be employed. Generally, the flow regulator(s) is coupled with a plurality of orifices and conduits through which the cooling fluid flows. Related system components can be assembled as a module for installation into a cooling system that includes other system components such as a pump, compressor or other pressure sources for the cooling fluid.

Claims (46)

1. A system for regulating and distributing cooling fluid flow through a plurality of cold plates coupled to one or more electronic devices, the system comprising:

one or more rejector plates in thermal communication with the one or more electronic devices via a fluid loop;

a flow regulator fluidicly coupled to a system pressure source;

a distribution header fluidicly coupled to the flow regulator;

a plurality of cooling fluid lines fluidicly coupled to the distribution header;

at least two orifices, each of the orifices being coupled to a cooling fluid line downstream of the flow regulator and the distribution header; and

a plurality of cold plates coupled to the plurality of fluid lines downstream of the orifices, wherein the system is configured to provide substantially uniform distribution of cooling fluid to the cold plates.

2. The system of claim 1 , wherein the pressure drop across each of the at least two orifices is less than an available system pressure differential.

3. The system of claim 1 , wherein the pressure drop across each of the at least two orifices is at least 1% greater than a total flow path pressure drop variation.

4. The system of claim 1 , further comprising more than one flow regulator downstream of the system pressure source and at least two orifices downstream of each flow regulator.

5. The system of claim 1 , further comprising a return line coupled downstream of the cold plates.

6. The system of claim 1 , wherein the system pressure source comprises a compressor or pump.

7. The system of claim 1 , further comprising a rack having one or more supporting surfaces for the one or more electronic devices.

8. A method of regulating and distributing cooling fluid flowing through at least one flow regulator, a plurality of orifices, and a plurality of cold plates coupled to one or more electronic devices, the method comprising:

coupling the cold plates to the electronic devices through one or more rejector plates via a fluid loop;

flowing the cooling fluid through the at least one flow regulator to the plurality of orifices wherein at least one of the orifices is fixed;

reducing a flow pressure through the plurality of orifices; and

flowing the reduced pressure cooling fluid through the cold plates for cooling the cold plates and absorbing heat from the one or more electronic devices, wherein flowing the reduced pressure cooling fluid through the cold plates comprises substantially uniformly distributing cooling fluid to the cold plates.

9. The method of claim 8 , further comprising creating a pressure drop across each of at least two of the orifices that is less than an available system pressure differential using a pressure source for the cooling fluid.

10. The method of claim 8 , further comprising creating a pressure drop across each of at least two of the orifices that is at least 1% greater than a flow path pressure drop variation.

11. The method of claim 9 , further comprising creating a pressure drop across each of at least two of the orifices that is at least 1% greater than a flow path pressure drop variation.

12. The method of claim 8 , further comprising flowing the cooling fluid back to the system pressure source.

13. The method of claim 8 , further comprising pressurizing the cooling fluid with a pressure source.

14. The method of claim 8 , further comprising flowing the cooling fluid through a plurality of flow regulators, each flow regulator being coupled upstream of a plurality of orifices.

15. A method of regulating and distributing cooling fluid flowing through a plurality of flow regulators, a plurality of orifices, and a plurality of cold plates coupled to one or more electronic devices, the method comprising:

coupling the cold plates to the electronic devices through one or more rejector plates via a fluid loop;

flowing a cooling fluid through the plurality of flow regulators to the plurality of orifices wherein more than one orifice is downstream of each flow regulator;

reducing a flow pressure from a first fluid flow pressure to a second fluid flow pressure through the plurality of orifices; and

flowing the reduced pressure cooling fluid through the cold plates for cooling the cold plates and absorbing heat from the one or more electronic devices, wherein flowing the reduced pressure cooling fluid through the cold plates comprises substantially uniformly distributing cooling fluid to the cold plates.

16. The method of claim 15 , further comprising generating a pressure drop across each of the plurality of orifices that is at least two times the pressure drop variation in the fluid flow path.

17. The method of claim 16 , wherein the ratio of flow regulators to orifices ranges from 1:20 to 1:2.

18. The method of claim 16 , wherein the ratio of flow regulators to orifices ranges from 1:8 to 1:2.

19. A system for the regulation and distribution of cooling fluids through a plurality of cold plates adjoining one or more electronic devices within a cooling rack, the system comprising:

one or more rejector plates in thermal communication with the one or more electronic devices via a fluid loop;

a flow regulation means;

a fluid flow distribution means coupled to the flow regulation means;

a plurality of cooling fluid delivery means;

one or more orifices associated with the cooling fluid delivery means downstream of the flow regulation means and the fluid flow distribution means; and

a plurality of cold plates coupled to the plurality of fluid lines downstream of the orifices, wherein the system is configured to provide substantially uniform distribution of cooling fluid to the cold plates.

20. The system of claim 19 , wherein the orifices are fixed orifices.

21. A system for regulating and distributing cooling fluid flow through a plurality of cold plates coupled to one or more electronic devices, the system comprising:

one or more rejector plates in thermal communication with the one or more electronic devices via a fluid loop;

a flow regulator;

a distribution header downstream of the flow regulator;

at least two orifices downstream of the distribution header; and

a plurality of cold plates, each cold plate being downstream of one of the orifices, wherein the system is configured to provide uniform distribution of cooling fluid through the cold plates.

Assignments (9)
SECURITY INTEREST Recorded Oct 26, 2021
From: VERTIV CORPORATION; VERTIV IT SYSTEMS, INC.; ELECTRICAL RELIABILITY SERVICES, INC.; ENERGY LABS, INC.
To: UMB BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 057923/0782 →
SECURITY AGREEMENT Recorded Mar 3, 2020
From: ELECTRICAL RELIABILITY SERVICES, INC.; ENERGY LABS, INC.; VERTIV CORPORATION; VERTIV IT SYSTEMS, INC.
To: CITIBANK, N.A.
Reel/Frame 052076/0874 →
RELEASE OF SECURITY INTEREST Recorded Mar 2, 2020
From: JPMORGAN CHASE BANK, N.A.
To: VERTIV CORPORATION (F/K/A ALBER CORP.); VERTIV IT SYSTEMS, INC. (F/K/A AVOCENT CORPORATION); VERTIV IT SYSTEMS, INC. (F/K/A AVOCENT FREMONT, LLC); VERTIV IT SYSTEMS, INC. (F/K/A AVOCENT HUNTSVILLE, LLC); VERTIV IT SYSTEMS, INC. (F/K/A AVOCENT REDMOND CORP.); ELECTRICAL RELIABILITY SERVICES, INC.; VERTIV CORPORATION (F/K/A EMERSON NETWORK POWER, ENERGY SYSTEMS, NORTH AMERICA, INC.); VERTIV CORPORATION (F/K/A LIEBERT CORPORATION)
Reel/Frame 052065/0666 →
RELEASE OF SECURITY INTEREST Recorded Mar 2, 2020
From: THE BANK OF NEW YORK MELLON TRUST COMPANY N.A.
To: VERTIV CORPORATION; VERTIV IT SYSTEMS, INC.; ELECTRICAL RELIABILITY SERVICES, INC.
Reel/Frame 052071/0913 →
SECOND LIEN SECURITY AGREEMENT Recorded Jun 10, 2019
From: VERTIV IT SYSTEMS, INC.; VERTIV CORPORATION; VERTIV NORTH AMERICA, INC.; ELECTRICAL RELIABILITY SERVICES, INC.; VERTIV ENERGY SYSTEMS, INC.
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A.
Reel/Frame 049415/0262 →
CHANGE OF NAME Recorded Sep 19, 2018
From: LIEBERT CORPORATION
To: VERTIV CORPORATION
Reel/Frame 047110/0573 →
SECURITY AGREEMENT Recorded Dec 2, 2016
From: ALBER CORP.; ASCO POWER TECHNOLOGIES, L.P.; AVOCENT CORPORATION; AVOCENT FREMONT, LLC; AVOCENT HUNTSVILLE, LLC; AVOCENT REDMOND CORP.; ELECTRICAL RELIABILITY SERVICES, INC.; EMERSON NETWORK POWER, ENERGY SYSTEMS, NORTH AMERICA, INC.; LIEBERT CORPORATION; LIEBERT NORTH AMERICA, INC.; NORTHERN TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 040797/0615 →
SECURITY AGREEMENT Recorded Dec 1, 2016
From: ALBER CORP.; ASCO POWER TECHNOLOGIES, L.P.; AVOCENT CORPORATION; AVOCENT FREMONT, LLC; AVOCENT HUNTSVILLE, LLC; AVOCENT REDMOND CORP.; ELECTRICAL RELIABILITY SERVICES, INC.; EMERSON NETWORK POWER, ENERGY SYSTEMS, NORTH AMERICA, INC.; LIEBERT CORPORATION; LIEBERT NORTH AMERICA, INC.; NORTHERN TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 040783/0148 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 3, 2008
From: SPEARING, IAN
To: LIEBERT CORPORATION
Reel/Frame 020749/0522 →