Semiconductor memory device including a semiconductor film made of a material having a spontaneous polarization and method for fabricating the same
View Patent ↗A semiconductor memory device is composed of a field effect transistor using the interface between a ferroelectric film and a semiconductor film as the channel and including a gate electrode to which a voltage for controlling the polarization state of the ferroelectric film is applied and source/drain electrodes provided on both ends of the channel to detect a current flowing in the channel in accordance with the polarization state. The semiconductor film is made of a material having a spontaneous polarization and the direction of the spontaneous polarization is parallel with the interface between the ferroelectric film and the semiconductor film.
1. A semiconductor memory device comprising a field effect transistor using an interface between a ferroelectric film and a semiconductor film as a channel, wherein the field effect transistor comprises:
a gate electrode to which a voltage for controlling a polarization state of the ferroelectric film is applied; and
source/drain electrodes provided on both ends of the channel to detect a current flowing in the channel in accordance with the polarization state, wherein
the semiconductor film is made of a material having a spontaneous polarization and a direction of the spontaneous polarization is parallel with the interface between the ferroelectric film and the semiconductor film.
2. The semiconductor memory device of claim 1 , wherein
the semiconductor film is formed on the ferroelectric film by epitaxial growth and
the direction of the spontaneous polarization is controlled by a crystal orientation of the ferroelectric film.
3. The semiconductor memory device of claim 1 , wherein
the semiconductor film has a wurtzite-type crystal structure and
a <11-20> direction or a <1-100> direction thereof is perpendicular to a principal surface of the semiconductor film.
4. The semiconductor memory device of claim 3 , wherein the semiconductor film is made of ZnO, GaN, InN, or InGaN.
5. The semiconductor memory device of claim 1 , wherein the semiconductor film has a thickness of not more than 60 nm.
6. The semiconductor memory device of claim 5 , wherein the semiconductor film has a carrier concentration of not more than 1×10 17 cm −3 .
7. The semiconductor memory device of claim 2 , wherein
the ferroelectric film is made of lead zirconium titanate (Pb(Zr 1−x, Ti x )O 3 (0≦x≦1) having a tetragonal crystal structure and
a <001> direction thereof is perpendicular to a principal surface of the ferroelectric film.
8. The semiconductor memory device of claim 7 , wherein a <100> direction in a plane of the ferroelectric film coincides with a <1-102> direction in a plane of the semiconductor film.
9. The semiconductor memory device of claim 2 , wherein
the ferroelectric film is made of lead zirconium titanate (Pb(Zr 1−x, Ti x )O 3 (0≦x≦1) having a rhombohedral crystal structure and
a <100> direction thereof is perpendicular to a principal surface of the ferroelectric film.
10. The semiconductor memory device of claim 9 , wherein a <001> direction in a plane of the ferroelectric film coincides with a <1-102> direction in a plane of the semiconductor film.
11. A method for fabricating the semiconductor memory device of claim 1 , the method comprising the steps of:
forming the gate electrode on a substrate;
continuously forming the ferroelectric film and the semiconductor film on the substrate to cover the gate electrode; and
forming the source/drain electrodes on a surface of the semiconductor film, wherein
the direction of spontaneous polarization of the semiconductor film is controlled by crystal orientation of the ferroelectric film.
12. The method for fabricating the semiconductor memory device of claim 11 , wherein the semiconductor film is formed on the ferroelectric film by epitaxial growth.
13. A method for fabricating the semiconductor memory device of claim 1 , the method comprising the steps of:
preparing a substrate cut out to have a non-polar surface as a surface thereof;
forming the semiconductor film on the substrate by epitaxial growth;
forming the source/drain electrodes on the semiconductor film;
forming the ferroelectric film on the semiconductor film to cover the source/drain electrodes;
forming the gate electrode on the ferroelectric film;
forming an insulating film on the ferroelectric film to cover the gate electrode;
planarizing the insulating film till a surface of the gate electrode is exposed;
bonding the planarized surface to a supporting substrate; and
removing the substrate till the semiconductor film is exposed.
14. The method for fabricating the semiconductor memory device of claim 13 , wherein the substrate is made of the same material as that of the semiconductor film.