Method of forming an HTS article
View Patent ↗A method of forming a superconducting article includes providing a substrate tape, forming a superconducting layer overlying the substrate tape, and depositing a capping layer overlying the superconducting layer. The capping layer includes a noble metal and has a thickness not greater than about 1.0 micron. The method further includes electrodepositing a stabilizer layer overlying the capping layer using a solution that is non-reactive to the superconducting layer. The superconducting layer has an as-formed critical current I C(AF) and a post-stabilized critical current I C(PS) . The I C(PS) is at least about 95% of the I C(AF) .
1. A method of forming a superconducting article comprising:
providing a substrate tape;
forming a superconducting layer overlying the substrate tape, the superconducting layer having an as-formed critical current I C(AF) ;
electrodepositing a capping layer having a thickness not greater than about 0.5 micron overlying the superconducting layer, the capping layer comprises silver wherein depositing the capping layer includes contacting the substrate tape including the superconducting layer with a silver electrodeposition solution, wherein the silver electrodeposition solution is non-reactive to the superconducting layer and consists essentially of silver nitrate, thiourea, and dimethylsulfoxide; and
electrodepositing a stabilizer layer overlying the capping layer using a solution that is non-reactive to the superconducting layer, the superconducting layer having a post-stabilized critical current I C(PS) , which is at least 95% of the I C(AF) ,
wherein the superconducting article has a length of greater than 5 m and a dimension ratio of not less than 10 2 .
2. The method of claim 1 wherein the I C(PS) is at least 97% of the I C(AF) .
3. The method of claim 1 wherein the I C(PS) is at least 99% of the I C(AF) .
4. The method of claim 1 wherein the superconducting layer includes a rare-earth oxide having a general formula REBa 2 Cu 3 O 7−x , where 0≧x>1.
5. The method according to claim 1 , wherein the thiourea is present in the electrodeposition solution at a concentration between 10 mM and 75 mM.