IP Library Granted Patent US 7,566,865
Granted Patent B2
US 7,566,865 · App. 12/033,752 · Granted Jul 28, 2009

Temperature controlled photodetector

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Quick Facts
Patent No.
US 7,566,865
App. No.
12/033,752
Granted
Jul 28, 2009
Kind
B2
Abstract

This disclosure describes a temperature controlled photodetector. The disclosed detector can reach a temperature at which responsivity is maximized within a short time and with little wasted power. Furthermore, the photodetector prevents thermal gradients from developing across the detector so that the whole detector region has equivalent responsivity.

Claims (32)

1. A temperature controlled photodetector comprising:

a semiconductor substrate having a photosensitive region;

a heating element in contact with the semiconductor substrate;

the semiconductor substrate being thermally isolated from a substrate mount; and

an enclosure comprising a window, attached to the substrate mount, and enclosing the semiconductor substrate and the heating element.

2. The photodetector of claim 1 wherein the heating element has a heating element area larger than a photosensitive area of the photosensitive region.

3. The photodetector of claim 1 wherein a thermally-isolating annular element separates the semiconductor substrate from the substrate mount.

4. The photodetector of claim 1 further comprising at least one electrically conductive lead extending from the heating element through the enclosure and the substrate mount.

5. The photodetector of claim 1 further comprising:

at least one electrically conductive lead extending from the photosensitive region through the enclosure and the substrate mount; and

at least one electrically conductive lead extending from the semiconductor substrate through the enclosure and the substrate mount.

6. The photodetector of claim 1 further comprising a temperature sensor within the enclosure.

7. The photodetector of claim 6 wherein the temperature sensor is in contact with the semiconductor substrate.

8. The photodetector of claim 1 wherein the heating element comprises an electrically-resistive material that generates heat when a current is passed through the electrically-resistive material.

9. The photodetector of claim 1 wherein the enclosure is hermetically sealed.

10. The photodetector of claim 1 wherein the window is optically transparent.

11. A temperature controlled photodetector comprising:

a semiconductor substrate having a photosensitive region;

a heating element in contact with the semiconductor substrate wherein the heating element comprises an electrically-resistive material generating heat when a current is passed through it;

wherein the heating element has a heating element area larger than a photosensitive area of the photosensitive region;

a thermally-isolating annular element in contact with the substrate mount and the semiconductor substrate;

a temperature sensor in contact with the semiconductor substrate;

a hermetically-sealed enclosure comprising a window transparent in the optical and near infrared, attached to the substrate mount, and enclosing the semiconductor substrate, the heating element, the thermally isolating element, and the temperature sensor;

at least one electrically conductive lead extending from the heating element through the enclosure and the substrate mount;

at least one electrically conductive lead extending from the photosensitive region through the enclosure and the substrate mount; and

at least one electrically conductive lead extending from the semiconductor substrate through the enclosure and the substrate mount.

12. The photodetector of claim 1 , wherein the photosensitive region comprises the entire volume of the semiconductor substrate.

13. The photodetector of claim 1 , wherein the photosensitive region comprises a plurality of photosensitive sub-regions.

14. The photodetector of claim 1 , wherein the heating element has a serpentine shape.

15. The photodetector of claim 1 , wherein the window comprises a lens.

16. The photodetector of claim 1 , further comprising a thermally-isolating element.

17. The photodetector of claim 16 , wherein the thermally-isolating element is annular.

Assignments (6)
RELEASE OF SECURITY INTEREST Recorded Feb 22, 2024
From: WELLS FARGO BANK, NATIONAL ASSOCIATION
To: ELBIT SYSTEMS OF AMERICA, LLC; KOLLSMAN, INC.
Reel/Frame 066525/0177 →
SECURITY INTEREST Recorded Feb 21, 2024
From: ELBIT SYSTEMS OF AMERICA, LLC; SPARTON CORPORATION; SPARTON DELEON SPRINGS, LLC; LOGOS TECHNOLOGIES LLC; ELBITAMERICA, INC.; KMC SYSTEMS, INC.
To: CAPITAL ONE, NATIONAL ASSOCIATION, AS AGENT
Reel/Frame 066642/0935 →
RELEASE OF SECURITY INTEREST Recorded Feb 21, 2024
From: WELLS FARGO BANK, NATIONAL ASSOCIATION
To: ELBIT SYSTEMS OF AMERICA, LLC
Reel/Frame 066644/0612 →
SECURITY INTEREST Recorded Sep 13, 2019
From: ELBIT SYSTEMS OF AMERICA, LLC
To: WELLS FARGO BANK, NATIONAL ASSOCIATION
Reel/Frame 050375/0425 →
CORRECTIVE ASSIGNMENT TO CORRECT THE GRANTORS SIGNATURE PAGE PREVIOUSLY RECORDED AT REEL: 034741 FRAME: 0874. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded Feb 18, 2015
From: ELBIT SYSTEMS OF AMERICA, LLC; KOLLSMAN, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 035035/0273 →
SECURITY INTEREST Recorded Jan 7, 2015
From: ELBIT SYSTEMS OF AMERICA, LLC; KOLLSMAN, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 034741/0874 →