Controlled lapping for an ABS damascene process
View Patent ↗Methods of lapping rows of recording heads are described after an air bearing surface (ABS) damascene process is performed. The ABS damascene process uses a selective etching process to form voids in the row of recording heads where conductive material forms a feature in the recording head, such as a wrap around shield. The conductive material is then deposited on the ABS of the row to fill the voids, and the row is lapped. According to methods provided herein, the resistance of one or more lapping guides in the row of recording heads is monitored to determine when the conductive material is removed by the lapping process. When the monitored resistance indicates that the conductive material is removed, the lapping process is stopped. The resistance across one or more lapping guides may also be used to control the lapping process to uniformly lap the conductive material from the ABS.
1. A method of controlling a lapping process for lapping conductive material from a row of recording heads, wherein the conductive material was deposited on an air bearing surface (ABS) of the row of recording heads during an ABS damascene process used to form a feature in the recording heads, the method comprising:
connecting electrical leads to at least one lapping guide on the row of recording heads, wherein the conductive material deposited during the ABS damascene process creates a short circuit across the at least one lapping guide;
performing a lapping process on the row of recording heads to remove the conductive material from the ABS of the row deposited during the ABS damascene process;
measuring a resistance of the at least one lapping guide in the row of recording heads; and
stopping the lapping process responsive to a measured resistance of the at least one lapping guide indicating that the conductive material deposited during the ABS damascene process has been removed from the ABS of the row of recording heads.
2. The method of claim 1 wherein measuring the resistance of at least one lapping guide comprises:
measuring the resistance of the at least one lapping guide to identify a change from a first resistance indicating a short circuit to a second resistance that is higher than a short circuit.
3. The method of claim 1 wherein connecting electrical leads to at least one lapping guide on the row of recording heads comprises:
connecting electrical leads to a plurality of lapping guides that are spaced along the row of recording heads.
4. The method of claim 1 wherein the at least one lapping guide comprises a magnetoresistance (MR) sensor formed in at least one of the recording heads.
5. The method of claim 1 wherein the at least one lapping guide comprises at least one electrical lapping guide (ELG) formed in the row of recording heads.
6. The method of claim 1 further comprising:
connecting a first electrical lead and a second electrical lead to a lapping guide on the row of recording heads;
measuring a resistance across the lapping guide; and
adjusting the lapping process based on the measure resistance to uniformly remove the conductive material from the ABS of the row of recording heads.
7. The method of claim 1 further comprising:
connecting a first electrical lead to a first lapping guide and a second electrical lead to a second lapping guide on the row of recording heads;
measuring a resistance across the first lapping guide and the second lapping guide; and
adjusting the lapping process based on the measure resistance to uniformly remove the conductive material from the ABS of the row of recording heads.
8. A method of controlling a lapping process for lapping conductive material from a row of recording heads, wherein the conductive material was deposited on an air bearing surface (ABS) of the row of recording heads during an ABS damascene process used to form features in the recording heads, the method comprising:
connecting a first electrical lead and a second electrical lead across at least one lapping guide on the row of recording heads, wherein the conductive material deposited during the ABS damascene process creates a short circuit across the at least one lapping guide;
performing a lapping process on the row of recording heads to remove the conductive material from the ABS of the row deposited during the ABS damascene process;
measuring a resistance across the at least one lapping guide; and
adjusting the lapping process based on the measured resistance to uniformly remove the conductive material from the ABS of the row of recording heads deposited during the ABS damascene process.
9. The method of claim 8 wherein connecting a first electrical lead and a second electrical lead across at least one lapping guide on the row of recording heads comprises:
connecting electrical leads across multiple sets of lapping guides that are spaced along the row of recording heads, wherein each set of lapping guides corresponds with a region of the row of recording heads.
10. The method of claim 9 wherein adjusting the lapping process based on the measured resistance comprises:
adjusting the lapping process in each region of the row of recording heads based on the resistance measured for each set of lapping guides so that each regions is lapped substantially uniform.
11. The method of claim 8 wherein the at least two lapping guides comprise magnetoresistance (MR) sensors formed in at least two recording heads.
12. The method of claim 8 wherein the at least two lapping guides comprise at least two electrical lapping guides (ELG) formed in the row of recording heads.
13. The method of claim 8 further comprising:
stopping the lapping process responsive to a measured resistance of the at least one lapping guide indicating that the conductive material has been removed from the ABS of the row of recording heads.