Semiconductor package
View Patent ↗A semiconductor package that includes a substrate having a metallic back plate, an insulation body and a plurality of conductive pads on the insulation body, and a semiconductor die coupled to said conductive pads, the conductive pads including regions readied for direct connection to pads external to the package using a conductive adhesive.
1. A semiconductor package comprising:
a semiconductor die that includes a first electrode on a surface thereof;
a support plate having a first surface and a second surface opposite said first surface;
an insulation body disposed directly on said first surface of said support plate; and
a plurality of laterally spaced conductive pads disposed directly on said insulation body, a first one of said conductive pads including a first region electrically and mechanically coupled to said first electrode with a conductive adhesive body interposed between said first electrode and said first region and a second region readied for connection using a conductive adhesive body to a conductive pad external to said package;
wherein said insulation body electrically insulates said plurality of laterally spaced conductive pads from said support plate.
2. The package of claim 1 , wherein said semiconductor die includes a second electrode lateral to said first electrode on said first surface of said semiconductor die, a second one of said conductive pads including a first region electrically and mechanically coupled to said second electrode with a conductive adhesive body interposed between said second electrode and said first region of said second conductive pad and a second region readied for connection using a conductive adhesive body to a conductive pad external to said package.
3. The package of claim 1 , wherein said semiconductor die includes a third electrode on another opposing surface thereof.
4. The package of claim 3 , wherein said third electrode is readied for connection using a conductive adhesive body to a conductive pad external to said package.
5. The package of claim 3 , further comprising a conductive clip electrically and mechanically coupled to said third electrode using a conductive adhesive body and to a third conductive pad of said plurality of laterally spaced conductive pads, said third conductive pad including a first region electrically and mechanically coupled to said conductive clip with a conductive adhesive body interposed between said conductive clip and said first region and a second region readied for connection using a conductive adhesive body to a conductive pad external to said package.
6. The package of claim 5 , wherein said first region and said second region of each conductive pad are disposed on opposite surfaces of said conductive pad.
7. The package of claim 6 , wherein said conductive pads extend beyond the peripheral edges of said insulation body.
8. The package of claim 1 , wherein said conductive pads are confined within peripheral edges of said insulation body.
9. The package of claim 1 , wherein each conductive pad includes a first region that is readied for electrical and mechanical connection using a conductive adhesive to a respective electrode of a semiconductor die, and a second region readied for electrical and mechanical connection using a conductive adhesive to a respective conductive pad external to said package, wherein said second regions are arranged along opposing edges of said insulation body.
10. The package of claim 9 , wherein said insulation body is generally rectangular and said second regions are disposed at only two opposing edges of said insulation body.
11. The package of claim 9 , wherein said insulation body is generally rectangular and said second regions are disposed along each edge of said insulation body.
12. The package of claim 11 , wherein said semiconductor die is an IC.
13. The package of claim 1 , wherein said support plate is metallic.