IP Library Granted Patent US 8,234,780
Granted Patent B2
US 8,234,780 · App. 12/038,338 · Granted Aug 7, 2012

Substrate carrier system

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Quick Facts
Patent No.
US 8,234,780
App. No.
12/038,338
Granted
Aug 7, 2012
Kind
B2
Abstract

A substrate carrier system is provided for physical management of substrate(s) during a variety of assembly techniques performed on the both sides of the substrate(s) without dismounting or changing carrier systems.

Claims (13)

1. A method of supporting a substrate during an assembly process, the method comprising:

providing a substrate carrier system including:

a frame having an outer edge, wherein the outer edge is structurally manipulated to strengthen the frame; and

at least two suspension arms extending from the frame for holding the substrate, wherein the suspension arms allow the substrate to be vertically translated relative to the frame;

wherein the frame and the suspension arms are formed from a same piece of material;

mounting the substrate to the carrier system; and

performing an assembly process on the substrate while the substrate is mounted to the carrier system.

2. The method of supporting a substrate of claim 1 , further comprising disposing of the substrate carrier system after the assembly process has been performed.

3. The method of supporting a substrate of claim 1 , wherein the assembly process is performed by a board handling system and the frame is strong enough to provide operable transfer through the board handling system during the assembly process.

4. The method of supporting a substrate of claim 1 , wherein the substrate carrier system facilitates the ability perform assembly techniques on both sides of the board(s) without dismounting or changing the carrier system.

5. The method of supporting a substrate of claim 1 , wherein the substrate carrier system permits easy yet precisely controlled post-mounting tensioning of a substrate mounted on to carrier system, tensioning facilitated through use of the suspension arms.

6. The method of supporting a substrate of claim 1 , wherein the carrier system is transported by means of suction cups vacuum attaching to land areas of the frame of the carrier system during performance of an assembly process.

7. The method of supporting a substrate of claim 1 , wherein the substrate is mounted to the carrier system by an adhesive distributed between the substrate and lands located at the distal ends of the suspension arms.

Assignments (5)
PATENT SECURITY AGREEMENT Recorded Jun 12, 2017
From: UNIVERSAL INSTRUMENTS CORPORATION; HOVER-DAVIS, INC.; UI ACQUISITION HOLDING CO.; UI HOLDING CO.
To: EAST WEST BANK
Reel/Frame 042765/0848 →
RELEASE OF SECURITY INTEREST Recorded Jun 1, 2017
From: WELLS FARGO CAPITAL FINANCE
To: UNIVERSAL INSTRUMENTS CORPORATION
Reel/Frame 042564/0204 →
RELEASE OF SECURITY INTEREST Recorded May 4, 2012
From: PATRIARCH PARTNERS AGENCY SERVICES, LLC
To: UI HOLDING CO. AND ITS SUBSIDIARIES: UNIVERSAL INSTRUMENTS CORP., AND HOVER DAVIS, INC.
Reel/Frame 028153/0826 →
PATENT SECURITY AGREEMENT Recorded Apr 5, 2012
From: UNIVERSAL INSTRUMENTS CORPORATION
To: WELLS FARGO CAPITAL FINANCE, LLC
Reel/Frame 027993/0472 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 27, 2008
From: HARVILCHUCK, LAURENCE A.; WESTBY, GEORGE R.
To: UNIVERSAL INSTRUMENTS CORPORATION
Reel/Frame 020569/0594 →